Product Overview
Available in addition curing and condensation curing versions, this high-safety Electronic Potting Compound specializes in encapsulation, sealing and gap filling for diverse electronic components. It boasts exceptional adhesive force and thermal stability for PCB, PC, PMMA, CPU and multiple materials including aluminum, copper and stainless steel. The cured silicone operates stably from -60℃ to 220℃, easing internal stress caused by thermal cycling and protecting internal chips and gold bonding wires from physical damage. Technical Specifications
Optimized with upgraded purified raw materials, this product adopts a exclusive volatile free encapsulation formula to reduce harmful fume emission and peculiar odor. It maintains ultra-low volatile content and excellent resistance to ozone and chemical corrosion. Meanwhile, it retains reliable heat dissipation performance same as our classic Thermally Conductive Potting Compound. Clients can customize cured hardness, viscosity and working time to fit various enclosed production environments.
Product Features & Advantages
Compared with traditional strong-odor potting silicone, our low-odor variant provides more humane manufacturing protection:
1. Zero Peculiar Smell: Premium volatile free encapsulation formula effectively suppresses harmful fumes without irritating odor during curing processes.
2. Operator Safety: Realizes professional workplace friendly module potting, perfectly suitable for closed and poorly ventilated production workshops.
3. Multi-dimensional Protection: Offers minimal fume protection alongside waterproof, dustproof, shockproof and electrical insulation performance.
4. Universal Substrate Adhesion: Firmly bonds most metals and engineering plastics to form a durable and airtight protective layer.
Application Scenarios
As an eco-conscious Electronic Encapsulation Adhesive, this low odor silicone is widely used for household electronics, indoor LED lighting, medical electronic equipment and wearable devices. Its humanized low-fume feature improves workshop working conditions, reduces occupational health risks, and helps manufacturers meet global environmental safety regulations to enhance brand competitiveness. Step-by-Step Usage Process
1. Pre-stirring: Evenly stir Part A to disperse settled fillers and fully shake Part B to ensure homogeneous raw materials.
2. Proportional Mixing: Mix two components strictly per standard AB weight ratio to preserve its low-odor core properties.
3. Vacuum Defoaming: Place blended silicone in a 0.01MPa vacuum container for 3 minutes to remove bubbles before pouring encapsulation.
4. Curing Method: Support room temperature and heating curing; full curing takes 24 hours, identical to our standard Silicone Encapsulant product series. Certifications and Compliance
All HONG YE SILICONE silicone products pass ISO9001, CE and RoHS authoritative certifications. This low odor Potting Compound complies with international volatile emission standards and global workplace safety specifications. Customization Options
We support personalized customization services. Buyers can adjust odor grade, material viscosity, cured hardness and curing speed to match exclusive indoor and enclosed encapsulation projects.
Production Process
We adopt dust-free sealed production and multi-stage safety testing. Every batch undergoes odor detection and volatile content inspection to guarantee stable minimal fume protection and workplace friendly performance for global purchasers.
FAQ
Q1: What makes low odor potting silicone different from regular glue?
A: It features volatile free encapsulation formula to achieve minimal fume protection, providing safe workplace
friendly module potting for enclosed working spaces.
Q2: Will colloidal stratification affect odor-free performance?
A: Colloid stratification is normal during long-term storage. Stir evenly before use, and its low-odor and physical
performance will not be affected.
Q3: How to store mixed low odor silicone?
A: Sealed original materials have long shelf life. Please consume mixed two-part compound at one time to avoid
performance attenuation.