HONG YE SILICONE Soft Gel Electronic Potting Silicone is a two-component, ultra-flexible potting gel engineered for fragile and stress-sensitive electronics. This premium stress relieving encapsulation compound cures into a jelly-like soft layer, delivering professional cushioning impact protection. It supports dedicated delicate component module potting, featuring wide-temperature resistance, insulation and waterproof performance to guard chips and gold bonding wires against vibration and thermal stress damage for precision electronic devices.
Product Overview
Offering addition-cured and condensation-cured versions, this high-performance Electronic Potting Compound is widely adopted for encapsulation, sealing and gap filling across electronic components. It boasts exceptional adhesive strength and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. Capable of stable operation ranging from -60℃ to 220℃, it effectively absorbs thermal cycling stress and prevents component cracking caused by harsh temperature fluctuations. Technical Specifications
Formulated with low-modulus flexible Silicone raw materials, this soft gel eliminates rigid extrusion stress on tiny electronic parts and realizes efficient stress relieving encapsulation compound effects. It features low volatile content, outstanding ozone resistance and chemical corrosion resistance. This product inherits excellent heat dissipation properties identical to our mainstream Thermally Conductive Potting Compound. Gel hardness, viscosity and curing time can be fully customized to match diverse precision encapsulation projects.
Product Features & Advantages
Different from traditional rigid potting adhesives, our soft gel silicone presents unique competitive strengths for precision packaging:
1. Stress-Free Protection: Acts as a high-efficiency stress relieving encapsulation compound to avoid structural damage to delicate electronic parts.
2. Powerful Shock Absorption: Provides long-lasting cushioning impact protection against external vibration, collision and pressure extrusion.
3. Precision Compatibility: Specially optimized for delicate component module potting, perfectly fit for microchips and miniature sensors.
4. All-Round Barrier Performance: Integrates waterproof, dustproof, insulating and anti-aging functions to adapt to complex industrial working environments.
Application Scenarios
As a flexible and high-value Electronic Encapsulation Adhesive, this soft gel potting silicone is extensively applied to medical electronics, wearable devices, micro-sensors, precision automotive electronics and high-end LED modules. It minimizes defective rates of fragile components, reduces daily maintenance costs, and outperforms ordinary rigid Silicone Encapsulant in low-stress encapsulation scenarios. Step-by-Step Usage Process
1. Pre-Stirring: Thoroughly stir component A to evenly disperse settled fillers and shake component B sufficiently before mixing.
2. Accurate Proportioning: Mix A and B materials strictly in specified weight ratio to retain original soft gel characteristics after curing.
3. Vacuum Defoaming: Place homogeneous mixed gel in a 0.01MPa vacuum chamber for 3 minutes to remove bubbles for flawless encapsulation.
4. Curing Guide: This additive-type potting material supports room-temperature and heating curing; full curing requires 24 hours, affected by ambient temperature and humidity.
Certifications and Compliance
All products under HONG YE SILICONE have obtained ISO9001, CE and RoHS certifications. This soft gel potting silicone complies with global export regulations and international manufacturing standards for precision electronic encapsulation.
Customization Options
We provide tailored customization services. Clients can adjust gel softness, material viscosity, thermal conductivity and operating pot life to satisfy personalized low-stress encapsulation demands.
Production Process
We implement dust-free closed production and multi-dimensional quality inspection. Each batch undergoes vibration resistance and stress aging tests to ensure stable cushioning impact protection for global high-end electronic manufacturers.
FAQ
Q1: What are the applicable scenarios for this soft gel silicone?
A: It is designed for fragile electronics, delivering stress relieving encapsulation compound, realizing delicate
component module potting and reliable cushioning impact protection for stress-sensitive devices.
Q2: Will colloidal stratification affect overall performance?
A: Colloid stratification is a normal storage phenomenon. Stir evenly before use, and its flexibility and protective
performance will not be compromised.
Q3: How to properly store mixed soft gel?
A: Sealed raw materials enjoy long shelf life. Please consume mixed two-part gel at one time to prevent
performance deterioration.
Shenzhen Hong Ye Jie Technology Co., Ltd
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