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Home> Products> Electronic Potting Compound> Low Viscosity High Flow Electronic Potting Compound
Low Viscosity High Flow Electronic Potting Compound
Low Viscosity High Flow Electronic Potting Compound
Low Viscosity High Flow Electronic Potting Compound
Low Viscosity High Flow Electronic Potting Compound
Low Viscosity High Flow Electronic Potting Compound
Low Viscosity High Flow Electronic Potting Compound

Low Viscosity High Flow Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9010

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic potting silicone
Product Description
HONG YE SILICONE’s Low Viscosity High Flow Electronic Potting Compound is a fluid two-part Silicone Encapsulant engineered for complex microelectronic structures. Featuring self leveling capillary action encapsulation capability, this formula enables void free thin section module potting and delivers intricate geometry penetration protection. It integrates insulation, waterproofing and thermal management, effortlessly permeating tiny gaps to fully encapsulate dense PCB components for high-precision electronic manufacturing.
 
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Product Overview

Available in addition and condensation curing versions, this fluid-grade Electronic Potting Compound specializes in gap filling, sealing and comprehensive encapsulation for compact electronics. It boasts superior wettability and stable adhesion on PCB, PC, PMMA, CPU plus multiple metals including aluminum, copper and stainless steel. After curing, it withstands temperatures from -60℃ to 220℃, relieves thermal cycling stress and shields delicate chips and bonding wires from physical and environmental damage.

Technical Specifications

Refined with low-viscosity silicone monomers, this encapsulant features ultra-high fluidity to realize self leveling capillary action encapsulation without external pressurization. It maintains low volatile content, excellent ozone resistance and chemical stability. Its thermal dissipation performance matches our flagship Thermally Conductive Potting Compound. Professionals can adjust viscosity, flow rate and cured hardness to meet diverse thin-layer and intricate encapsulation demands.
 
electronic silicone
 

Product Features & Advantages

Different from conventional high-viscosity potting adhesives, our high-flow silicone owns unique competitive edges:
1. Superior Fluidity: Achieve intricate geometry penetration protection, easily filling ultra-fine gaps inside densely arranged electronic components.
2. Self-leveling Performance: Realize automatic flat forming via self leveling capillary action encapsulation, cutting manual leveling labor costs.
3. Void-free Encapsulation: Support void free thin section module potting to eliminate hidden risks like bubble corrosion and partial short circuits.
4. Multi-barrier Protection: Equipped with waterproof, dustproof, anti-corrosion and shockproof functions to adapt to sophisticated industrial scenarios.

Application Scenarios

As a high-fluidity Electronic Encapsulation Adhesive, this product is perfect for micro sensors, high-density PCBs, miniature semiconductor modules and compact wearable electronics. Its powerful penetrating performance solves encapsulation difficulties for tiny structures, reducing defective rates effectively compared with ordinary viscous Silicone Encapsulant.

Step-by-Step Usage Process

1. Pre-Stirring: Evenly stir Part A to disperse settled fillers and fully shake Part B to guarantee uniform composition.
2. Scientific Proportioning: Mix A and B components strictly per standard weight ratio to preserve high-flow core characteristics.
3. Vacuum Defoaming: Place mixed fluid silicone in a 0.01MPa vacuum chamber for 3 minutes to remove internal micro bubbles.
4. Curing Guide: Support room-temperature or heating curing; complete curing takes 24 hours, affected by ambient temperature and humidity.

Certifications and Compliance

All HONG YE SILICONE silicone products are certified with ISO9001, CE and RoHS. This high-flow potting compound complies with global export standards and professional manufacturing specifications for precision microelectronics.

Customization Options

We provide exclusive personalized customization. Clients can adjust base viscosity, fluidity, thermal conductivity and curing cycle to fit intricate structural encapsulation projects.

Production Process

We adopt dust-free sealed production and multi-index quality inspection. Every batch undergoes fluidity testing and gap penetration verification to provide reliable intricate geometry penetration protection for global precision electronic buyers.

FAQ

Q1: What is the core advantage of high flow potting silicone?
A: It supports self leveling capillary action encapsulation, realizing void free thin section module potting and
providing stable intricate geometry penetration protection for compact electronic parts.
Q2: Will colloidal stratification affect fluidity?
A: Stratification is a normal storage trait. Stir evenly before use, and its fluidity and encapsulation performance
will not be negatively impacted.
Q3: Is pre-pressure needed during potting?
A: Unnecessary. The low-viscosity formula features natural high fluidity, which can automatically penetrate tiny
gaps for full encapsulation.
 
 
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