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Home> Products> Electronic Potting Compound> Reworkable Thermoplastic Electronic Potting Compound
Reworkable Thermoplastic Electronic Potting Compound
Reworkable Thermoplastic Electronic Potting Compound
Reworkable Thermoplastic Electronic Potting Compound
Reworkable Thermoplastic Electronic Potting Compound
Reworkable Thermoplastic Electronic Potting Compound
Reworkable Thermoplastic Electronic Potting Compound

Reworkable Thermoplastic Electronic Potting Compound

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-9020

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-6
Product Description
HONG YE SILICONE Reworkable Thermoplastic Electronic Potting Compound is a unique thermoplastic two-part potting material different from traditional irreversible curing silicone. Serving as a heat removable encapsulation material, it supports selective dissolution module potting and provides complete component salvageable protection. This recyclable electronic adhesive integrates insulation, waterproofing and thermal stability, allowing technicians to disassemble, repair and recover expensive chips and circuits, effectively cutting material waste and after-sales maintenance costs for electronic manufacturers.
 
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Product Overview

Available in tailored addition and condensation formulas, this reworkable Electronic Potting Compound performs encapsulation, sealing and pressure-resistant filling for various electronic components. It delivers excellent adhesion and stable thermal performance on PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. The compound maintains stable performance within -60℃~220℃, absorbs thermal cycling stress and protects bonding wires and chips while retaining reversible properties for convenient disassembly and repair.
 
electronic silicone
 
1. Heat Removable Design: Acts as a flexible heat removable encapsulation material, easily softened and stripped via moderate heating for internal access.
2. Precise Reworking: Realize professional selective dissolution module potting to target specific areas without damaging surrounding circuits.
3. Component Salvageable: Offer reliable component salvageable protection to recover high-cost electronic parts and reduce scrap loss.
4. Multi-functional Barrier: Equipped with waterproof, dustproof, anti-corrosion and shockproof performance for long-term daily protection.

Application Scenarios

As a cost-effective reworkable Electronic Encapsulation Adhesive, this thermoplastic compound is widely used for prototype testing, high-value automotive electronics, expensive sensor modules and small-batch customized devices. It is the optimal substitute for rigid, non-repairable Silicone Encapsulant, perfectly fitting R&D testing and after-sales repair scenarios across electronic industries.

Step-by-Step Usage Process

1. Pre-Stirring: Stir Part A thoroughly to redistribute settled fillers and shake Part B evenly before material mixing.
2. Accurate Proportioning: Mix A and B components strictly per standard weight ratio to maintain stable thermoplastic reworkable features.
3. Vacuum Defoaming: Place blended potting compound inside a 0.01MPa vacuum container for 3 minutes to eliminate bubbles before pouring.
4. Curing & Rework: Achieve full curing within 24 hours under ambient conditions; rework by heating to specified temperature to soften and remove the adhesive layer.

Certifications and Compliance

All HONG YE SILICONE products are certified with ISO9001, CE and RoHS. This reworkable thermoplastic potting compound complies with international environmental standards and global electronic manufacturing export regulations.

Customization Options

We provide personalized customization services. Clients can adjust softening temperature, adhesive viscosity, cured hardness and operating time to satisfy exclusive reworkable encapsulation demands.

Production Process

We adopt dust-free standardized production and dual performance testing. Every batch undergoes temperature resistance and reworkability verification to deliver stable component salvageable protection for global R&D and manufacturing clients.

FAQ

Q1: What is the biggest difference from ordinary potting silicone?
A: It adopts thermoplastic formula, working as a heat removable encapsulation material to support selective
dissolution module potting and provide reusable component salvageable protection.
Q2: Will colloidal stratification affect rework performance?
A: Stratification is normal during storage. Stir evenly before use, and its curing effect and reworkable characteristics
will not be affected.
Q3: What’s the suitable scenario for this product?
A: It is highly recommended for R&D prototypes, high-value electronics and products requiring later maintenance,
repair and component replacement.
 
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