HONG YE SILICONE Stress Absorbing Soft Gel Electronic Potting Compound is a low-modulus, ultra-soft two-part silicone gel tailored for fragile microelectronic components. Adopting professional low modulus elastomer encapsulation formula, this gel enables safe fragile wire bond module potting and delivers long-lasting vibration dampening protection. Different from rigid potting adhesives, this stress-absorbing gel offsets thermal expansion and external vibration, preventing gold wires and delicate chips from breakage under harsh cycling working environments.
Product Overview
Available in addition and condensation curing formulas, this soft-gel Electronic Potting Compound focuses on gentle encapsulation, sealing and gap filling for stress-sensitive electronics. It features excellent adhesion and thermal stability on PCB, PC, PMMA, CPU and various substrates including aluminum, copper and stainless steel. Cured soft gel operates stably at -60℃ to 220℃, actively absorbs thermal stress and mechanical shock, and maximally safeguards fragile wire bonds and core chips inside electronic modules. Technical Specifications
Formulated with flexible elastomer resin, this material maintains ultra-low hardness after curing to realize premium low modulus elastomer encapsulation without generating extrusion stress on components. It has low volatile content, outstanding ozone resistance and chemical inertness. Its heat dissipation capability is comparable to our mature Thermally Conductive Potting Compound. We can customize gel hardness, viscosity and pot life to fit various fragile wire bond module potting scenarios.
Product Features & Advantages
This soft gel potting compound possesses irreplaceable advantages compared with regular hard silicone encapsulants:
1. Stress Absorption Property: Low modulus elastomer encapsulation design relieves thermal expansion stress caused by high-low temperature cycling.
2. Fragile Parts Protection: Optimized for fragile wire bond module potting to avoid wire breakage and chip cracking induced by rigid curing stress.
3. Vibration Dampening: Provide efficient vibration dampening protection for devices exposed to continuous shaking and mechanical impact.
4. Multi-functional Barrier: Integrate waterproof, insulating and dustproof performance to achieve dual protection of stress buffering and environmental isolation.
Application Scenarios
As a stress-relief Electronic Encapsulation Adhesive, this soft gel is widely applied to high-precision sensors, semiconductor chips, automotive control units and miniature electronic modules with fragile internal structures. It effectively reduces component scrap rate, becoming the optimal substitute for high-hardness traditional Silicone Encapsulant. Step-by-Step Usage Process
1. Pre-Stirring: Evenly stir Part A to disperse internal flexible fillers and fully shake Part B to ensure uniform composition.
2. Accurate Proportioning: Mix A and B components strictly following standard weight ratio to retain stable low-modulus soft gel characteristics.
3. Vacuum Defoaming: Place blended gel in a 0.01MPa vacuum container for 3 minutes to eliminate bubbles before perfusion encapsulation.
4. Curing Operation: Support room-temperature or heating curing; full curing takes 24 hours, and curing progress is affected by ambient temperature and humidity.
Certifications and Compliance
All HONG YE SILICONE products pass ISO9001, CE and RoHS authoritative certifications. This stress-absorbing soft gel complies with global export standards and precision electronic manufacturing specifications.
Customization Options
We provide exclusive personalized customization. Clients can adjust gel viscosity, softness degree and thermal conductivity to match customized vibration dampening encapsulation solutions.
Production Process
We adopt dust-free sealed production and dual performance testing. Every batch undergoes stress simulation and vibration testing to deliver reliable low modulus elastomer encapsulation and fragile wire bond module potting for global high-precision electronic manufacturers.
FAQ
Q1: What is the core difference between soft gel and ordinary potting silicone?
A: It adopts low modulus elastomer encapsulation, realizes professional fragile wire bond module potting, and
provides efficient vibration dampening protection without extra curing stress on components.
Q2: Will colloidal stratification affect soft gel performance?
A: Colloid stratification is a normal storage phenomenon. Stir evenly before use, and its flexibility and stress-absorbing
performance remain unchanged.
Q3: Is this gel suitable for frequently vibrating automotive electronics?
A: Absolutely. Its built-in vibration dampening protection is specially developed for automotive electronics and outdoor
vibration-prone precision devices.
Shenzhen Hong Ye Jie Technology Co., Ltd
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