HONG YE SILICONE’s High Purity Semiconductor Grade Electronic Potting Compound is a refined ultra-clean two-component silicone for wafer manufacturing and microchip packaging. Formulated as a low sodium ion encapsulation material, this product realizes strict trace metal controlled module potting and delivers reliable wafer fab compatible protection. It eliminates ionic contamination and metal residue risks, featuring wide temperature adaptability, insulation and thermal conductivity to meet stringent cleanliness standards for high-end semiconductor manufacturing environments.
Product Overview
Available in addition and condensation curing formulas, this high-purity Electronic Potting Compound focuses on encapsulation, sealing and gap filling for sensitive semiconductor components. It provides exceptional adhesion and thermal stability for PCB, PC, PMMA, CPU and various metal substrates including aluminum, copper and stainless steel. Cured silicone operates stably at -60℃ to 220℃, absorbs thermal cycling stress, and protects delicate wafers and gold bonding wires without releasing harmful ionic impurities. Technical Specifications
Purified via multi-stage impurity removal processes, this low sodium ion encapsulation material maintains ultra-low content of sodium ions, chloride ions and heavy metals. It boasts low volatile content, excellent ozone resistance and chemical inertness. Its heat dissipation performance is comparable to our mature Thermally Conductive Potting Compound. We support customized viscosity, hardness and pot life to satisfy diverse trace metal controlled module potting projects for semiconductor factories.
Product Features & Advantages
This semiconductor-grade silicone differs greatly from regular industrial potting adhesives with high-purity attributes:
1. Ultra-High Purity: Manufactured with advanced purification technology to serve as qualified low sodium ion encapsulation material for sensitive chips.
2. Strict Impurity Control: Achieve precise trace metal controlled module potting to prevent electrochemical corrosion inside semiconductor modules.
3. Fab Compatibility: Offer standardized wafer fab compatible protection, perfectly matching clean-room production and packaging procedures.
4. Multi-dimensional Barrier: Integrate waterproof, shockproof and high-voltage insulation properties to balance cleanliness and component protection.
Application Scenarios
As a high-end Electronic Encapsulation Adhesive, this semiconductor-grade compound is widely used for wafer packaging, integrated circuits, semiconductor sensors and clean-room electronic modules. It effectively reduces chip failure caused by ion contamination, acting as the preferred high-purity alternative to ordinary industrial Silicone Encapsulant. Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A to evenly disperse high-purity fillers and shake Part B uniformly inside a dust-free environment.
2. Accurate Proportioning: Mix A and B components strictly per official weight ratio to retain stable high-purity physical properties.
3. Vacuum Defoaming: Place blended potting compound into a 0.01MPa vacuum container for 3 minutes to remove bubbles before clean-room perfusion.
4. Curing Operation: Support room-temperature or heating curing; complete curing takes 24 hours, and operators need to stabilize ambient humidity to avoid external contamination.
Certifications and Compliance
All HONG YE SILICONE products are certified with ISO9001, CE and RoHS. This high-purity potting compound complies with international semiconductor material specifications and clean-room manufacturing standards.
Customization Options
We provide exclusive personalized customization. Clients can adjust viscosity, cured hardness and thermal conductivity to create tailored wafer fab compatible encapsulation solutions.
Production Process
We adopt Class 100 dust-free production and rigorous impurity testing. Every batch undergoes ion and metal content detection to deliver qualified low sodium ion encapsulation material and trace metal controlled module potting for global semiconductor manufacturers.
FAQ
Q1: Why use high-purity silicone for semiconductor packaging?
A: It is a professional low sodium ion encapsulation material that realizes trace metal controlled module potting
and provides stable wafer fab compatible protection to avoid chip corrosion.
Q2: Will colloidal stratification affect purity performance?
A: Stratification is a normal storage trait. Stir evenly in a clean environment before use, and its high-purity
characteristics will not be affected.
Q3: Can this product be used in clean room workshops?
A: Yes. The whole production formula and process are optimized for clean rooms, fully meeting wafer-level
semiconductor encapsulation requirements.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
