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Home> Products> Electronic Potting Compound> Dual Cure Mechanism Electronic Potting Silicone
Dual Cure Mechanism Electronic Potting Silicone
Dual Cure Mechanism Electronic Potting Silicone
Dual Cure Mechanism Electronic Potting Silicone
Dual Cure Mechanism Electronic Potting Silicone
Dual Cure Mechanism Electronic Potting Silicone
Dual Cure Mechanism Electronic Potting Silicone

Dual Cure Mechanism Electronic Potting Silicone

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-230

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound
Product Description
HONG YE SILICONE’s Dual Cure Mechanism Electronic Potting Silicone adopts innovative UV plus moisture hybrid encapsulation technology, breaking the limitations of single curing silicone adhesives. This dual-system potting material supports effective shadow area curing module potting and delivers reliable flexible process adaptability protection. It can be rapidly cured by UV light for exposed areas and fully solidified via ambient moisture for shaded zones, perfectly solving uncured issues for complex-structured electronics and optimizing overall production efficiency.
 
HY-SILICONE company
 

Product Overview

Available in addition and condensation curing formulas, this dual-cure Electronic Potting Compound is engineered for encapsulation, sealing and gap filling of intricate electronic assemblies. It features excellent adhesion and thermal stability for PCB, PC, PMMA, CPU and diverse metal substrates including aluminum, copper and stainless steel. After curing, the silicone operates stably between -60℃ and 220℃, relieves thermal cycling stress, and protects chips and bonding wires with dual curing modes to adapt complicated packaging layouts.
 

Product Features & Advantages

This dual-cure silicone outperforms traditional single-curing potting products with flexible processing strengths:
1. Dual-Cure Design: Adopt mature UV plus moisture hybrid encapsulation to realize dual curing modes and eliminate processing restrictions.
2. Shadow Zone Solidification: Achieve professional shadow area curing module potting to solve uncured problems for covered and hidden gaps.
3. High Process Flexibility: Provide all-round flexible process adaptability protection, compatible with automated and manual assembly lines.
4. Comprehensive Protection: Possess waterproof, insulation and shockproof properties to balance processing convenience and component safety.
 
electronic silicone

Application Scenarios

As a multi-process Electronic Encapsulation Adhesive, this dual cure silicone is widely used for 3D structured sensors, irregular LED modules, stacked circuit boards and compact precision electronics. It lowers product defective rates caused by incomplete curing, serving as an upgraded alternative to traditional single-cure Silicone Encapsulant.

Step-by-Step Usage Process

1. Pre-Stirring: Evenly stir Part A to disperse functional curing fillers and fully shake Part B to guarantee homogeneous components.
2. Accurate Proportioning: Mix A and B components strictly per official weight ratio to maintain stable dual-cure structural performance.
3. Vacuum Defoaming: Place blended silicone in a 0.01MPa vacuum container for 3 minutes to remove bubbles before perfusion encapsulation.
4. Curing Operation: Cure exposed parts via UV irradiation; hidden areas complete secondary curing through ambient moisture, and full solidification takes 24 hours.

Certifications and Compliance

All HONG YE SILICONE products pass ISO9001, CE and RoHS authoritative certifications. This dual-cure potting silicone complies with global precision electronic manufacturing standards and export regulations.

Customization Options

We offer exclusive personalized customization. Clients can adjust viscosity, cured hardness and UV/moisture curing speed to develop tailored flexible process adaptability encapsulation solutions.

Production Process

We adopt dust-free sealed production and dual curing performance testing. Every batch undergoes UV & moisture curing verification to deliver qualified UV plus moisture hybrid encapsulation and shadow area curing module potting for global electronic manufacturers.

FAQ

Q1: What is the core advantage of dual cure mechanism?
A: It realizes UV plus moisture hybrid encapsulation, supports shadow area curing module potting, and offers
flexible process adaptability protection for complex-shaped electronic components.
Q2: Will colloidal stratification affect curing effect?
A: Stratification is a normal storage feature. Stir evenly before use, and its dual-cure efficiency and protective
performance will not be compromised.
Q3: Is this product friendly to automated production?
A: Definitely. Its dual curing modes adapt to various assembly processes, greatly improving production flexibility
for automated mass production lines.
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