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Home> Products> Electronic Potting Compound> High Hardness Rigid Electronic Potting Compound
High Hardness Rigid Electronic Potting Compound
High Hardness Rigid Electronic Potting Compound
High Hardness Rigid Electronic Potting Compound
High Hardness Rigid Electronic Potting Compound
High Hardness Rigid Electronic Potting Compound
High Hardness Rigid Electronic Potting Compound

High Hardness Rigid Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9040

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound
Product Description
HONG YE SILICONE’s High Hardness Rigid Electronic Potting Compound is a professional durable solid shell encapsulation material designed for electronic modules requiring high structural stability. It supports impact resistant rigid module potting and delivers long-lasting structural reinforcement protection. Different from flexible silicone, this rigid Potting Compound forms a hard protective shell after curing, effectively resisting external impact, pressure and extrusion damage, ideal for industrial electronics with strict mechanical protection requirements.
 
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Product Overview

Available in addition and condensation curing formulas, this high-rigidityElectronic potting compound specializes in high-strength encapsulation, sealing and structural filling of precision electronic components. It offers excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. Cured material operates stably between -60℃ and 220℃, absorbs thermal cycling stress, and protects internal chips and bonding wires with rigid structural support.

Technical Specifications

Formulated with high-strength rigid fillers, this durable solid shell encapsulation material features low volatile content, outstanding ozone resistance and chemical corrosion resistance. It retains excellent heat dissipation performance comparable to our classic Thermally Conductive Potting Compound. We customize cured hardness, viscosity and operating time to meet diversified impact resistant rigid module potting and structural reinforcement demands.
 
electronic silicone
 

Product Features & Advantages

This rigid high-hardness silicone outperforms flexible potting products in mechanical protection scenarios:
1. High Structural Hardness: Forms a durable solid shell encapsulation after curing to provide rigid support for loose electronic components.
2. Strong Impact Resistance: Realize reliable impact resistant rigid module potting to resist external extrusion, collision and mechanical damage.
3. Permanent Structural Protection: Deliver stable structural reinforcement protection to prevent component displacement and circuit breakage.
4. Comprehensive Barrier Performance: Integrate waterproof, insulation, dustproof and high-low temperature resistant functions for all-round module protection.

Application Scenarios

As a high-strength industrial Electronic Encapsulation Adhesive, this product is widely used for industrial control circuits, heavy-duty equipment electronics, precision instrument modules and impact-prone electrical components. It effectively improves equipment durability, serving as an upgraded rigid alternative to flexible conventionalSilicone Encapsulant.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir Part A to evenly disperse rigid functional fillers and shake Part B thoroughly for uniform mixing.
2. Accurate Proportioning: Mix A and B components strictly per standard weight ratio to ensure stable hardness and structural strength.
3. Vacuum Defoaming: Place blended compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles for flawless rigid encapsulation.
4. Curing Operation: Support room temperature or heating curing; full curing takes 24 hours, with ambient temperature and humidity affecting final rigid performance.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards. This high-hardness rigid potting compound meets global industrial electronic manufacturing specifications.

Customization Options

We provide personalized customization. Clients can adjust product hardness, viscosity and curing speed to develop exclusive structural reinforcement protection encapsulation solutions.

Production Process

We adopt dust-free standardized production and strict hardness testing. Every batch is verified for rigidity and impact resistance to ensure qualified durable solid shell encapsulation and impact resistant rigid module potting performance.

FAQ

Q1: What is the difference between rigid and flexible potting silicone?
A: It forms a hard protective shell, realizing durable solid shell encapsulation and impact resistant rigid module
potting, providing stronger structural reinforcement protection against mechanical damage.
Q2: Will colloid stratification affect cured hardness?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and its rigidity, hardness and protective
performance remain unchanged.
Q3: Is it suitable for outdoor heavy-duty electronic equipment?
A: Yes. Its high hardness and impact resistance effectively resist external extrusion and harsh environments,
perfectly protecting heavy-duty outdoor electronic modules.
 
 
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