HONG YE SILICONE’s Strippable Conformal Electronic Potting Silicone is a professional peelable protective encapsulation layer designed for electronic modules requiring inspection, repair and rework. It supports flexible temporary coating module potting and provides reliable selective removal rework protection. Unlike permanent encapsulation silicone, this conformal Potting Compound can be fully stripped without damaging circuit boards or components, perfectly fitting prototype testing, batch inspection and maintainable electronic equipment protection scenarios.
Product Overview
Available in addition and condensation curing formulas, this reworkable Electronic Potting Compound is widely used for conformal sealing, filling and surface protection of precision electronic components. It features moderate adhesion and excellent thermal stability for PCB, PC, PMMA, CPU and multiple metal substrates. Cured silicone operates stably from -60℃ to 220℃, absorbs thermal cycling stress, and protects chips and bonding wires with complete insulation, waterproof and dustproof performance while retaining easy-stripping characteristics. Technical Specifications
Formulated with special moderate-adhesion molecular structure, this peelable protective encapsulation layer has low volatile content, outstanding ozone resistance and chemical corrosion resistance. It retains basic heat dissipation performance consistent with our classic Thermally Conductive Potting Compound. We customize peeling strength, viscosity and curing time to meet diverse temporary coating module potting and selective removal rework protection demands.
Product Features & Advantages
This strippable conformal silicone has irreplaceable advantages over permanent Silicone Encapsulant for maintainable electronic scenarios: 1. Easy Stripping & Zero Damage: Form a complete peelable protective encapsulation layer that can be manually stripped without scratching PCB or component surfaces.
2. Rework-Friendly Performance: Realize professional temporary coating module potting to support circuit inspection, component replacement and product rework.
3. Flexible Protection Mode: Deliver stable selective removal rework protection, balancing long-term environmental protection and later maintenance convenience.
4. Comprehensive Barrier Performance: Integrate insulation, waterproof, shockproof and wide temperature resistance for all-round temporary module protection.
Application Scenarios
As a maintainable conformal Electronic Encapsulation Adhesive, this product is ideal for electronic prototypes, testing equipment, experimental circuit modules and frequently maintained industrial electronics. It effectively reduces rework costs and improves product repair efficiency, solving the maintenance difficulty of fully sealed permanent encapsulation products. Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A evenly to disperse functional fillers and shake Part B thoroughly for uniform composition.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable peeling performance and sealing effect.
3. Vacuum Defoaming: Place blended silicone in a 0.01MPa vacuum container for 3 minutes to remove bubbles for flat conformal coating.
4. Curing Operation: Support room temperature or heating curing with 24-hour full curing cycle; stable environment guarantees consistent strippable performance.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards. This strippable potting silicone meets global electronic testing and maintenance industry specifications.
Customization Options
We provide personalized customization. Clients can adjust peeling strength, viscosity and hardness to develop exclusive selective removal rework protection encapsulation solutions.
Production Process
We adopt dust-free standardized production and strict peeling performance testing. Every batch is verified for strippability and protective performance to ensure qualified temporary coating module potting quality.
FAQ
Q1: What is the biggest difference from ordinary potting silicone?
A: It forms a peelable protective encapsulation layer, supports temporary coating module potting, and provides
selective removal rework protection for later circuit maintenance.
Q2: Will colloid stratification affect stripping performance?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and its easy-stripping and protective
properties remain unchanged.
Q3: Is it suitable for electronic product prototype testing?
A: Yes. Its reworkable and non-damage stripping features perfectly match prototype testing, inspection and
iterative upgrading scenarios.
Shenzhen Hong Ye Jie Technology Co., Ltd
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