HONG YE SILICONE’s Thermally Conductive Electronic Potting Compound is a high-efficiency heat dissipating encapsulation material tailored for heat-generating electronic devices. It acts as a professional thermal management module Potting Compound and provides reliable power component cooling protection. This two-part silicone integrates excellent thermal conductivity, insulation and environmental resistance, solving overheating failure issues of power modules. It stably operates in -60℃ to 220℃ environments, ideal for high-power electronic encapsulation and long-term thermal stability maintenance.
Product Overview
Available in addition and condensation curing types, this high-performance Thermally Conductive Potting Compound is a core functional Electronic potting compound for power electronics. It is widely used for encapsulation, sealing and gap filling of heat-generating components such as PCB and CPU. It features superior adhesion and thermal stability for PC, PMMA, aluminum, copper and stainless steel, effectively transferring internal heat and protecting chips and bonding wires from thermal cycling stress damage. Technical Specifications
Adopting high-purity thermally conductive fillers, this heat dissipating encapsulation material has low volatile content, outstanding ozone resistance and chemical corrosion resistance. It maintains balanced thermal conductivity and insulation performance. Key parameters including viscosity, hardness and operating time are adjustable, meeting customized thermal management module potting compound and power component cooling protection demands for diverse high-power devices.
Product Features & Advantages
This thermal conductive silicone outperforms ordinary insulating Silicone Encapsulant in heat dissipation scenarios: 1. Efficient Heat Dissipation: Professional heat dissipating encapsulation material rapidly exports internal heat to avoid device overheating and performance attenuation.
2. Stable Thermal Management: Realize precise thermal management module potting compound to maintain constant temperature operation of power electronic modules.
3. Integrated Multi-Protection: Deliver all-round power component cooling protection, with waterproof, insulation, shockproof and wide-temperature resistant properties.
4. High Compatibility: Boast excellent bonding strength for various metals and plastic substrates, ensuring tight and durable encapsulation.
Application Scenarios
As a functional Electronic Encapsulation Adhesive, it is widely applied to power supplies, inverter modules, automotive power electronics and industrial high-power control components. It effectively reduces overheating failure rates, extends device service life and lowers manufacturers’ after-sales maintenance costs. Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A evenly to disperse conductive fillers completely and shake Part B thoroughly for uniform composition.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable thermal conductivity and curing effect.
3. Vacuum Defoaming: Place blended glue in a 0.01MPa vacuum container for 3 minutes to remove bubbles and guarantee uniform heat dissipation.
4. Curing Operation: Support room temperature or heating curing; full curing takes 24 hours, with ambient temperature and humidity affecting curing efficiency.
Certifications and Compliance
All HONG YE SILICONE products pass ISO9001, CE and RoHS international certifications. This thermally conductive potting compound complies with global high-power electronic thermal management industry standards.
Customization Options
We provide personalized parameter customization. Clients can adjust thermal conductivity, viscosity and hardness to develop exclusive thermal management encapsulation solutions.
Production Process
We adopt dust-free standardized production and strict thermal conductivity testing. Every batch is inspected for heat dissipation performance and adhesion to ensure stable and qualified product quality.
FAQ
Q1: What is the core advantage over ordinary potting silicone?
A: It is a professional heat dissipating encapsulation material and thermal management module potting compound,
providing targeted power component cooling protection to prevent overheating failure.
Q2: Will colloid stratification affect thermal conductivity?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and the heat dissipation and insulation
performance remain unchanged.
Q3: Is it suitable for long-term working high-power power modules?
A: Yes. It features stable thermal conductivity and high-temperature resistance, perfectly adapting to long-term
high-load operation of power electronic modules.
Shenzhen Hong Ye Jie Technology Co., Ltd
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