HONG YE SILICONE’s Medium Viscosity Electronic Potting Compound is a universal balanced flow thixotropic encapsulation silicone for general electronic packaging. It delivers accurate moderate penetration module potting and stable versatile application process protection. Balancing fluidity and structural support, it avoids overflow and incomplete filling issues. Featuring wide temperature resistance (-60℃ to 220℃) and multi-protection performance, it serves as an all-around solution for most industrial and consumer electronic encapsulation scenarios.
Product Overview
This high-performance Electronic Potting Compound is available in addition and condensation curing formulas. It acts as a multi-functional Electronic Encapsulation Adhesive for sealing, filling and shockproof protection of electronic components. It boasts excellent adhesion and thermal stability on PCB, CPU, PC, PMMA, aluminum, copper and stainless steel. With low volatility and high structural strength, it absorbs thermal cycling stress to protect chips and bonding wires for long-term stable operation. Technical Specifications
Designed with balanced viscosity formula, this Silicone Encapsulant features ideal balanced flow thixotropic encapsulation performance. It supports standard moderate penetration module potting, with outstanding ozone resistance and chemical erosion resistance. It retains reliable heat dissipation performance same as our classic Thermally Conductive Potting Compound. Viscosity, hardness and working time can be adjusted to meet customized versatile application process protection requirements.
Product Features & Advantages
1. Balanced Flow Performance: Achieve stable balanced flow thixotropic encapsulation, compatible with manual and automatic potting without overflow or voids.
2. Moderate Penetration: Uniform moderate penetration module potting fills conventional gaps perfectly, forming tight and full protective layers.
3. All-Round Protection: Integrates waterproof, dustproof, insulation, shockproof and wide-temperature resistant properties from -60℃ to 220℃.
4. Strong Compatibility: Excellent bonding strength for various plastics and metals, ensuring durable encapsulation and sealing effects.
Step-by-Step Usage Process
1. Pre-Mixing Preparation: Stir component A fully to homogenize settled fillers and shake component B thoroughly before use.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to guarantee stable viscosity and curing performance.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles for flawless encapsulation.
4. Curing Procedure: Cure at room temperature or elevated temperature; full curing takes 24 hours, with temperature and humidity affecting curing speed.
Application Scenarios
Ideal for general consumer electronics, standard power modules, LED equipment and industrial control boards, this medium viscosity potting compound provides reliable versatile application process protection. It improves production efficiency, reduces defective rates and extends electronic device service life for global manufacturers.
Certifications and Compliance
All HONG YE SILICONE silicone products comply with ISO9001, CE and RoHS international standards. This encapsulation material meets global industrial electronic safety and environmental protection specifications.
Customization Options
Customizable parameters include viscosity, cured hardness and operating time to match diverse electronic encapsulation and production process demands.
Production Process
Adopting dust-free standardized production and strict quality inspection, every batch is tested for fluidity, penetration and bonding performance to ensure stable and consistent product quality.
FAQ
Q1: What are the core advantages of medium viscosity potting silicone?
A: It features balanced flow thixotropic encapsulation, realizing precise moderate penetration module
potting and versatile application process protection, suitable for most universal electronic packaging scenarios.
Q2: Will colloidal stratification influence usage effect?
A: Colloid stratification is a normal storage phenomenon. Even stirring before use will not affect fluidity,
penetration and final protection performance.
Q3: Is this product suitable for automated production lines?
A: Yes. Its stable viscosity and excellent thixotropy adapt to both manual and automated potting processes
for mass production.
Shenzhen Hong Ye Jie Technology Co., Ltd
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