Product Overview
Available in addition and condensation curing formulas, this anti-hydrolysisElectronic Potting Compound specializes in encapsulation, sealing and waterproof filling of precision electronic components. As a high-performance Electronic Encapsulation Adhesive, it delivers excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel. It absorbs thermal cycling stress, protects chips and bonding wires, and avoids performance degradation caused by long-term moisture invasion. Technical Specifications
With optimized hydrolysis-resistant molecular structure, this professional Silicone Encapsulant forms stable water resistant chemical bond encapsulation layers. It features low volatility, outstanding ozone and chemical corrosion resistance, and retains steady heat dissipation performance same as our classic Thermally Conductive Potting Compound. Viscosity, hardness and operating time are customizable for exclusive moisture degradation module potting solutions.
Product Features & Advantages
1. Superior Hydrolysis Stability: Unique chemical structure realizes long-term anti-hydrolysis performance, preventing colloid aging, softening and peeling in wet environments.
2. Moisture Degradation Resistance: Complete stable moisture degradation module potting to block moisture penetration and avoid circuit short circuit and insulation failure.
3. Long-Term Wet Protection: Provide durable long term wet environment protection for electronics working continuously in humid and water-contact conditions.
4. Multi-Performance Integration: Integrate waterproof, dustproof, wide-temperature resistance and shockproof properties with strong substrate bonding strength.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A evenly and shake Part B thoroughly to disperse hydrolysis-resistant functional fillers uniformly.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable anti-hydrolysis and curing performance.
3. Vacuum Defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3 minutes to remove bubbles for seamless waterproof encapsulation.
4. Curing Operation: Support room temperature or heating curing with 24-hour full curing cycle; ambient temperature and humidity affect curing efficiency.
Application Scenarios
This hydrolysis-stable silicone is widely applied to outdoor electronics, underwater monitoring modules, coastal electrical equipment and household humid-environment electronic devices. It greatly reduces moisture-induced failure rates, extends equipment service life and lowers manufacturers’ long-term operation and maintenance costs.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global wet-environment electronic safety and durability specifications.
Customization Options
We support personalized parameter customization of hardness, viscosity and curing time to match diverse long-term wet environment encapsulation demands.
Production Process
We adopt dust-free standardized production and strict hydrolysis resistance testing. Every batch is verified for wet environment stability to guarantee reliable long-term protective performance.
FAQ
Q1: What is the core advantage of this potting silicone?
A: It features stable water resistant chemical bond encapsulation, realizing effective moisture degradation
module potting and long term wet environment protection for electronic modules.
Q2: Will long-term humid exposure damage the encapsulation layer?
A: No. Its professional anti-hydrolysis structure resists moisture erosion and aging, maintaining intact protection
performance in long-term wet environments.
Q3: Does colloidal stratification affect hydrolysis resistance?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and its anti-hydrolysis and overall
protective performance remain unchanged.