HONG YE SILICONE’s High Tensile Strength Electronic Potting Silicone is a mechanically reinforced encapsulation material built for heavy-duty electronic modules. It delivers professional tear resistant protective encapsulation, stable mechanical robust module potting and reliable physical damage prevention protection. Featuring upgraded tensile and tear resistance, it resists cracking, stretching and mechanical impact. It stably operates at -60℃ to 220℃, absorbing thermal cycling stress and providing long-term structural protection for easily damaged precision electronic components.
Product Overview
Available in addition and condensation curing formulas, this high-strength Electronic Potting Compound specializes in high-load encapsulation, sealing and anti-pressure filling of industrial electronics. As a premium Electronic Encapsulation Adhesive, it provides exceptional adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel. Its high mechanical strength effectively protects chips and bonding wires from physical extrusion and tensile damage in complex working environments. Technical Specifications
With reinforced polymer molecular structure, this durable Silicone Encapsulant realizes excellent tear resistant protective encapsulation. It features low volatility, outstanding ozone and chemical erosion resistance, and maintains stable heat dissipation performance consistent with our classic Thermally Conductive Potting Compound. Hardness, viscosity and working time are customizable to meet diverse mechanical robust module potting demands.
Product Features & Advantages
1. Ultra-High Tensile Performance: Realize stable mechanical robust module potting, resisting stretching and structural fracture under long-term mechanical stress.
2. Superior Tear Resistance: Professional tear resistant protective encapsulation avoids colloid cracking caused by vibration, extrusion and temperature alternating stress.
3. Reliable Physical Protection: Provide lasting physical damage prevention protection to reduce electronic module breakage and failure rates.
4. Multi-Barrier Performance: Integrate waterproof, insulation, dustproof and wide-temperature resistance with strong bonding strength for diverse substrates.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A evenly and shake Part B thoroughly to uniformly disperse high-strength functional fillers.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable tensile strength and curing performance.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles for intact encapsulation structure.
4. Curing Operation: Support room temperature or heating curing with 24-hour full curing cycle; ambient temperature and humidity affect curing efficiency.
Application Scenarios
This high-tensile silicone is widely applied to industrial control modules, vehicle-mounted electronics, vibrating mechanical equipment and heavy-duty electrical devices. It greatly reduces mechanical damage failure rates, extends product service life and lowers manufacturers’ after-sales replacement and maintenance costs.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global industrial electronic mechanical protection specifications.
Customization Options
We support personalized parameter customization of hardness, viscosity and tensile strength to adapt to different mechanical load working scenarios.
Production Process
We adopt dust-free standardized production and strict mechanical performance testing. Every batch is inspected for tensile and tear resistance to ensure stable mechanical robust module potting quality.
FAQ
Q1: What is the core advantage of this potting silicone?
A: It features high tensile strength formula, providing professional tear resistant protective encapsulation,
mechanical robust module potting and effective physical damage prevention protection.
Q2: Will long-term vibration cause colloid cracking?
A: No. The reinforced structure absorbs vibration and tensile stress, maintaining intact encapsulation layer
without cracking or peeling.
Q3: Does colloidal stratification affect mechanical performance?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and its tensile strength and protective
performance remain unchanged.
Shenzhen Hong Ye Jie Technology Co., Ltd
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