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Home> Products> Electronic Potting Compound> Standard Grade Electronic Potting Compound
Standard Grade Electronic Potting Compound
Standard Grade Electronic Potting Compound
Standard Grade Electronic Potting Compound
Standard Grade Electronic Potting Compound
Standard Grade Electronic Potting Compound
Standard Grade Electronic Potting Compound

Standard Grade Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9040

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic potting silicone
Product Description
HONG YE SILICONE’s Standard Grade Electronic Potting Compound is a cost-effective general-use silicone encapsulation material for mainstream electronic manufacturing. It acts as a reliable general use protective encapsulation material, practical basic grade module Potting Compound and stable common application circuit protection solution. Balancing excellent comprehensive performance and high cost performance, it features wide temperature adaptability from -60℃ to 220℃, basic insulation, waterproof and shockproof functions, perfectly meeting daily encapsulation demands of most civilian and commercial electronic modules.
 
package2

Product Overview

Available in addition and condensation curing formulas, this versatile Electronic potting compound is designed for universal electronic sealing, filling and pressure resistance protection. As a classic daily-use Electronic Encapsulation Adhesive, it delivers stable adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. It absorbs conventional thermal cycling stress and protects chips and bonding wires from daily environmental erosion and mechanical damage.

Technical Specifications

As a mature basic grade module potting compound, this standard Silicone Encapsulant integrates basic waterproof, insulation, dustproof and anti-corrosion properties. It features low volatile content, excellent ozone and chemical erosion resistance, and retains standard heat dissipation performance consistent with conventional Thermally Conductive Potting Compound. Viscosity, hardness and operating time support flexible customization to fit diverse common application circuit protection needs.
 
electronic silicone

Product Features & Advantages

1. High Cost Performance: Ideal general use protective encapsulation material with complete basic protective functions and affordable cost for mass production.
2. Universal Compatibility: This basic grade module potting compound fits most common electronic substrates and conventional working environments.
3. Stable Basic Protection: Provide reliable common application circuit protection against moisture, dust, vibration and moderate temperature fluctuation.
4. Easy Operation & High Stability: Low volatility, strong bonding strength, simple curing process and no performance attenuation in daily use.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A evenly and shake component B thoroughly to homogenize settled fillers.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable curing and protective performance.
3. Vacuum Defoaming: Place mixed adhesive in a 0.01MPa vacuum container for 3 minutes to remove bubbles for smooth encapsulation.
4. Curing Operation: Cure at room temperature or heated condition; full curing takes 24 hours, affected by ambient temperature and humidity.

Application Scenarios

This standard grade compound is widely applied to civilian electronics, household appliance modules, ordinary industrial control circuits and daily electrical components. It effectively reduces daily circuit failure rates, simplifies production processes and lowers overall procurement and manufacturing costs for electronic manufacturers.

Certifications and Compliance

All HONG YE SILICONE standard products comply with ISO9001, CE and RoHS international standards, meeting global mainstream civilian electronic safety and environmental protection specifications.

Customization Options

We support personalized adjustment of cured hardness, viscosity and operating time to adapt to different conventional production and application scenarios.

Production Process

Adopting standardized dust-free production and strict routine performance testing, every batch guarantees stable basic protection quality and consistent product batch uniformity.

FAQ

Q1: What are the core advantages of this standard grade potting compound?
A: It is a cost-effective general use protective encapsulation material, providing stable basic grade module
potting and reliable common application circuit protection for mass electronic production.
Q2: Is it suitable for daily mass production?
A: Yes. It features simple operation, stable performance and affordable cost, perfectly suitable for large-batch
conventional electronic encapsulation.
Q3: Does colloidal stratification affect use effect?
A: Stratification is a normal storage phenomenon. Even stirring before use will not affect its basic protective
performance.
 
 
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