HONG YE SILICONE’s Economical Electronic Potting Silicone is a high-cost-performance industrial encapsulation solution. It serves as a professional cost effective board sealing solution, premium value grade encapsulating material and stable budget reliable component protection option. This budget-friendly silicone retains complete basic protective performance, supporting stable operation from -60℃ to 220℃. It effectively protects conventional electronic components, helping manufacturers cut production costs while ensuring stable circuit operation.
Product Overview
Available in addition and condensation curing types, this cost-efficient Electronic Potting Compound is tailored for large-batch conventional electronic production. As a practicalElectronic Encapsulation Adhesive, it achieves excellent sealing, filling and pressure-resistant protection for electronic parts. It features great adhesion and thermal stability for PCB, PC, PMMA, CPU and multiple metals, acting as an affordable yet reliable Silicone Encapsulant for daily electronic encapsulation scenarios. Technical Specifications
This value-grade potting silicone integrates comprehensive basic properties including waterproof, insulation, dustproof and anti-corrosion. It boasts low volatile content, excellent ozone and chemical erosion resistance, and basic heat dissipation performance similar to standard Thermally Conductive Potting Compound. It can absorb thermal cycling internal stress, with customizable viscosity, hardness and working time to meet diverse budget sealing demands.
Product Features & Advantages
1. Superior Cost Performance: Ideal cost effective board sealing solution with full basic protection and competitive pricing for mass manufacturing.
2. Reliable Basic Performance: Premium value grade encapsulating material with wide temperature resistance, strong bonding strength and stable physical properties.
3. All-Round Circuit Protection: Provides long-term budget reliable component protection against moisture, dust, vibration and chemical erosion.
4. Easy & Stable Operation: Simple AB component mixing process, low volatility and no performance degradation after standard curing.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir component A evenly and shake component B thoroughly to homogenize settled functional fillers.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to guarantee consistent curing and protective effects.
3. Vacuum Defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3 minutes to remove bubbles for flawless sealing.
4. Curing Operation: Support room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.
Application Scenarios
This economical silicone is widely used for household appliances, civilian electronic devices, ordinary industrial control boards and low-power electrical components. It stabilizes product quality, reduces component failure rates, and greatly lowers manufacturers’ bulk procurement and after-sales maintenance costs.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global civilian and industrial electronic safety specifications.
Customization Options
We support personalized adjustment of cured hardness, viscosity and operating time to fit various conventional budget encapsulation projects.
Production Process
We adopt standardized dust-free production and strict batch testing. Every product undergoes performance inspection to ensure stable quality and consistent batch uniformity for mass supply.
FAQ
Q1: What is the core advantage of this economical potting silicone?
A: It is a cost effective board sealing solution and value grade encapsulating material, providing budget reliable
component protection without sacrificing basic electronic protective performance.
Q2: Is it suitable for large-batch mass production?
A: Yes. It features low cost, stable performance and simple operation, perfectly matching large-scale conventional
electronic encapsulation production.
Q3: Does colloidal stratification influence usage performance?
A: Colloid stratification is a normal storage phenomenon. Even stirring before use will not affect its sealing and
protection performance.
Shenzhen Hong Ye Jie Technology Co., Ltd
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