Product Overview
Technical Specifications
This workhorse module potting compound boasts low volatile content, stable structural strength and outstanding environmental resistance. It resists ozone erosion, chemical corrosion and thermal cycling stress effectively, protecting internal chips and bonding wires from temperature alternation damage. Viscosity, hardness and operating time support flexible customization to fit diverse everyday use protective encapsulation scenarios.
Product Features & Advantages
1. High Practicality: Premium everyday use protective encapsulation material with full basic protective functions for most conventional electronics.
2. Cost-Effective Performance: Provides reliable affordable circuit board sealing protection, greatly reducing bulk production procurement costs.
3. Stable & Dependable: This workhorse module potting compound features uniform curing effect, strong bonding and long-term stable physical properties.
4. Wide Compatibility: Excellent adhesion for various circuit boards and metals, adapting to most daily electronic assembly environments.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir component A evenly and shake component B thoroughly to homogenize settled fillers.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable curing quality.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles for flawless encapsulation.
4. Curing Operation: Support room temperature or heating curing; full curing completes in 24 hours, affected by ambient temperature and humidity.
Application Scenarios
This practical grade silicone is widely applied to household appliances, consumer electronics, ordinary industrial control circuits and daily electrical components. It stabilizes product quality, lowers defective rates, and helps manufacturers simplify material selection and cut overall production costs.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global civilian electronic manufacturing safety and environmental requirements.
Customization Options
We support personalized adjustment of cured hardness, viscosity and operating time to match different routine production needs.
Production Process
We adopt standardized dust-free production and batch performance testing. Strict quality control ensures stable and consistent quality for every batch of practical-grade potting silicone.
FAQ
Q1: What is the positioning of this potting silicone?
A: It is an everyday use protective encapsulation material and workhorse module potting compound, providing
reliable affordable circuit board sealing protection for mass conventional electronic production.
Q2: Is it suitable for long-term mass production?
A: Yes. It features stable performance, simple operation and cost advantages, perfectly suitable for long-term
batch electronic encapsulation.
Q3: Does colloidal stratification affect practical use?
A: Colloid stratification is a normal storage phenomenon. Even stirring before use will not affect its protective
performance and usage effect.