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Home> Products> Electronic Potting Compound> Moisture Resistant Electronic Potting Compound
Moisture Resistant Electronic Potting Compound
Moisture Resistant Electronic Potting Compound
Moisture Resistant Electronic Potting Compound
Moisture Resistant Electronic Potting Compound
Moisture Resistant Electronic Potting Compound
Moisture Resistant Electronic Potting Compound

Moisture Resistant Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9030

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting
Product Description
HONG YE SILICONE’s Moisture Resistant Electronic Potting Compound is a specialized damp-proof silicone encapsulation material for humid and wet working environments. It acts as a professional humidity barrier protective encapsulation material and high-performance damp proof module potting silicone, delivering reliable wet environment circuit sealing protection. Featuring superior hydrophobic performance and wide temperature tolerance of -60℃ to 220℃, it effectively blocks moisture, dew and corrosive gas. It stabilizes electronic circuit operation in high-humidity areas and prevents short-circuit and aging failure caused by dampness.
 
package4

Product Overview

Available in addition and condensation curing formulas, this anti-humidity Electronic Potting Compound focuses on long-term moisture-proof sealing of electronic components. As a functional Electronic Encapsulation Adhesive, it offers stable adhesion and sealing performance for PCB, PC, PMMA, CPU and various metal substrates. This customized Silicone Encapsulant retains excellent heat dissipation properties of standard Thermally Conductive Potting Compound, solving circuit damage issues in humid and wet scenarios perfectly.

Technical Specifications

This damp proof module potting silicone features low volatility, high structural strength and outstanding waterproof and moisture barrier capability. It resists ozone and chemical erosion effectively, and absorbs thermal cycling stress to protect chips and bonding wires. Its stable hydrophobic layer maintains long-term intact sealing in high humidity environments. Viscosity, hardness and operating time support personalized adjustment for diverse wet environment circuit sealing protection needs.
 
electronic silicone

Product Features & Advantages

1. Superior Moisture Barrier: Premium humidity barrier protective encapsulation material forms a dense waterproof layer to isolate moisture and humid air thoroughly.
2. Excellent Damp Resistance: This damp proof module potting silicone prevents circuit dampening, short circuit and oxidation in long-term humid environments.
3. All-Weather Stability: Reliable wet environment circuit sealing protection with wide temperature resistance and anti-aging performance for long-term service.
4. Strong Comprehensive Performance: Integrates insulation, heat dissipation, shockproof and anti-corrosion functions while maintaining core moisture-resistant advantages.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir Part A evenly and shake Part B thoroughly to uniformly disperse functional fillers.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure complete curing and intact moisture-resistant structure.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles for seamless damp-proof sealing.
4. Curing Operation: Support room temperature or heating curing; full curing takes 24 hours, with stable performance after complete molding.

Application Scenarios

This moisture-resistant compound is widely used for outdoor electronics, bathroom electrical modules, coastal humidity-sensitive equipment and industrial wet-environment circuits. It greatly reduces damp-related failure rates, extends electronic product service life and lowers manufacturers’ after-sales maintenance costs.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global environmental and safety specifications for electronic encapsulation materials.

Customization Options

We support customized adjustment of hardness, viscosity and curing time to adapt to different high-humidity application scenarios.

Production Process

We adopt standardized dust-free production and strict damp resistance testing. Each batch is inspected for hydrophobic and sealing performance to guarantee stable moisture-proof protection.

FAQ

Q1: What is the core advantage of this potting compound?
A: It is a professional humidity barrier protective encapsulation material and damp proof module potting silicone,
providing durable wet environment circuit sealing protection for humidity-sensitive electronics.
Q2: Can it work stably in long-term high-humidity environments?
A: Yes. Its dense cured structure effectively isolates moisture and humid air, maintaining stable circuit protection
without damp failure for years.
Q3: Does colloidal stratification affect moisture resistance?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and the original damp-proof and sealing
performance will remain unchanged.
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