Product Overview
Available in addition and condensation curing formulas, this anti-aging Electronic Potting Compound solves common aging problems of traditional encapsulation materials. As a durableElectronic Encapsulation Adhesive, it boasts excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel. This high-performance Silicone Encapsulant retains outstanding heat dissipation capacity of standard Thermally Conductive Potting Compound, achieving dual advantages of heat management and permanent anti-aging protection. Technical Specifications
This oxidation resistance module potting silicone features ultra-low volatile content and high structural strength. It effectively resists ultraviolet aging, ozone corrosion and chemical oxidation, and buffers internal stress generated by extreme temperature alternation to protect chips and bonding wires. All physical and chemical indicators remain stable for a long time. Hardness, viscosity and operating time support personalized customization to meet diverse long-life encapsulation demands.
Product Features & Advantages
1. Superior Anti-Aging Performance: Realizes long term stability protective encapsulation, avoiding yellowing, cracking and performance attenuation after long-term operation.
2. Powerful Oxidation Resistance: This oxidation resistance module potting silicone isolates air oxidation sources to protect internal circuits and metal parts from oxidative damage.
3. Extended Service Lifespan: Provides professional extended lifespan circuit board protection, greatly reducing equipment aging failure rates.
4. Multi-Functional Stable Protection: Integrates waterproof, insulation, shockproof and anti-corrosion performance with permanent anti-aging advantages.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A evenly and shake Part B thoroughly to uniformly disperse anti-aging functional fillers.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure complete curing and stable anti-aging structure.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles for seamless encapsulation.
4. Standard Curing: Support room temperature or heating curing; full curing takes 24 hours to form a complete anti-aging protective layer.
Application Scenarios
This anti-aging potting compound is widely used in outdoor electronic equipment, industrial control modules, intelligent monitoring devices and long-service life electrical products. It effectively extends electronic product service life, reduces equipment replacement and maintenance costs, and improves product stability and market competitiveness for manufacturers.
Certifications and Compliance
All HONG YE SILICONE silicone products comply with ISO9001, CE and RoHS international standards, meeting global industrial electronic safety and environmental protection specifications.
Customization Options
We support customized adjustment of cured hardness, viscosity and operating time to adapt to different long-term anti-aging protection scenarios.
Production Process
We adopt standardized dust-free production and strict aging simulation tests. Each batch undergoes long-term oxidation and temperature cycle tests to guarantee stable long-term anti-aging performance.
FAQ
Q1: What is the core advantage of this potting compound?
A: It provides long term stability protective encapsulation. As an oxidation resistance module potting silicone,
it delivers durable extended lifespan circuit board protection for long-running electronics.
Q2: Can it resist outdoor long-term aging and oxidation?
A: Yes. The optimized anti-aging formula effectively resists air oxidation, ozone erosion and temperature aging,
maintaining stable protection for years.
Q3: Does colloidal stratification affect anti-aging performance?
A: Colloid stratification is a normal storage phenomenon. Stir evenly before use, and the original anti-aging
and oxidation resistance performance will not be affected.