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Home> Products> Electronic Potting Compound> Low Thermal Expansion Electronic Potting Silicone
Low Thermal Expansion Electronic Potting Silicone
Low Thermal Expansion Electronic Potting Silicone
Low Thermal Expansion Electronic Potting Silicone
Low Thermal Expansion Electronic Potting Silicone
Low Thermal Expansion Electronic Potting Silicone
Low Thermal Expansion Electronic Potting Silicone

Low Thermal Expansion Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9035

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-5
Product Description
HONG YE SILICONE’s Low Thermal Expansion Electronic Potting Silicone is a high-precision encapsulation material designed for temperature-sensitive electronic modules. It delivers professional coefficient matched protective encapsulation, ultra-stable thermally stable dimension module potting and efficient thermal cycle stress reduction protection. Featuring minimal thermal expansion and contraction, it perfectly matches substrate expansion coefficients. It operates steadily from -60℃ to 220℃, eliminating component cracking and delamination caused by temperature alternating stress.
 
HY-SILICONE company

Product Overview

Available in addition and condensation curing types, this dimension-stable Electronic Potting Compound focuses on precision encapsulation and sealing of high-accuracy electronic parts. As a reliable Electronic Encapsulation Adhesive, it offers excellent adhesion and thermal stability for PCB, PC, PMMA, CPU and multiple metal materials. It effectively releases internal thermal stress and protects delicate chips and bonding wires from thermal cycle damage.

Technical Specifications

Formulated with low-shrinkage molecular structure, this high-precision Silicone Encapsulant realizes ideal coefficient matched protective encapsulation. It features low volatility, outstanding chemical and ozone resistance, and retains stable heat dissipation performance like our classic Thermally Conductive Potting Compound. Viscosity, hardness and operating time are customizable for exclusive thermally stable dimension module potting solutions.
 
electronic silicone

Product Features & Advantages

1. Ultra-Low Thermal Expansion: Achieve precise coefficient matched protective encapsulation to avoid expansion extrusion and shrinkage cracking.
2. Dimensional Stability: Professional thermally stable dimension module potting ensures zero deformation under repeated high and low temperature cycles.
3. Stress Reduction Performance: Provide efficient thermal cycle stress reduction protection to extend service life of precision electronic components.
4. Comprehensive Protection: Integrate insulation, waterproof, dustproof and shockproof properties with strong bonding strength for diverse substrates.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir Part A evenly and shake Part B thoroughly to disperse low-expansion functional fillers uniformly.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable dimensional stability after curing.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles for flawless encapsulation.
4. Curing Operation: Support room temperature or heating curing with 24-hour full curing cycle; ambient conditions affect curing uniformity.

Application Scenarios

This low thermal expansion silicone is widely used for precision sensors, automotive electronic modules, industrial control chips and high-precision communication devices. It reduces thermal deformation failure rates, improves product precision consistency and cuts long-term maintenance costs for manufacturers.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global precision electronic encapsulation quality and safety specifications.

Customization Options

We support personalized customization of hardness, viscosity and thermal expansion coefficient to fit diverse precision temperature-cycle working scenarios.

Production Process

We adopt dust-free standardized production and strict thermal cycle testing. Every batch is verified for dimensional stability to guarantee reliable thermal cycle stress reduction protection.

FAQ

Q1: What is the core advantage of this potting silicone?
A: It features coefficient matched protective encapsulation and thermally stable dimension module potting,
providing professional thermal cycle stress reduction protection for precision electronics.
Q2: Will long-term temperature cycles cause encapsulation peeling?
A: No. Its low expansion formula matches substrate deformation, effectively buffering thermal stress without
delamination or cracking.
Q3: Does colloidal stratification affect dimensional stability?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and its low thermal expansion and
protective performance remain unchanged.
 
 
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