Product Overview
Available in addition and condensation curing formulas, this signal-friendly Electronic Potting Compound focuses on encapsulation, sealing and shockproof filling of radar, antenna and RF electronic components. As a high-end Electronic Encapsulation Adhesive, it offers excellent adhesion and thermal stability for PCB, PC, PMMA, CPU and multiple metal substrates. It absorbs thermal cycling stress, protects chips and bonding wires while retaining pure signal transmission for precision wireless devices. Technical Specifications
Adopting low-dielectric molecular formula, this premium Silicone Encapsulant achieves professional RF transparent dielectric encapsulation with extremely low signal attenuation. It features low volatility, outstanding ozone and chemical corrosion resistance, and reserves stable heat dissipation performance same as our classic Thermally Conductive Potting Compound. Viscosity, hardness and operating time are customizable for exclusive low loss module potting solutions.
Product Features & Advantages
1. Superior RF Transparency: Realize high-purity RF transparent dielectric encapsulation with negligible radar wave blocking, no signal distortion.
2. Ultra-Low Loss Performance: Complete stable low loss module potting to ensure minimal dielectric loss for high-frequency radar modules.
3. Beam Integrity Protection: Provide long-term antenna beam integrity protection, maintaining accurate radiation angle and signal stability.
4. Harsh Environment Stability: Integrate waterproof, insulation, dustproof and wide-temperature resistance without affecting RF performance.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A evenly and shake Part B thoroughly to disperse functional fillers without affecting low-loss properties.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable RF transparent performance.
3. Vacuum Defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3 minutes to remove bubbles and avoid signal scattering.
4. Curing Operation: Support room temperature or heating curing with 24-hour full curing cycle; ambient conditions ensure flawless encapsulation effect.
Application Scenarios
This radar transparent silicone is widely applied to vehicle radar modules, communication antennas, drone sensing devices and high-frequency RF electronic equipment. It balances full electronic protection and zero signal interference, improves product signal accuracy and stability, and enhances core market competitiveness for manufacturers.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global high-frequency electronic and communication industry specifications.
Customization Options
We support personalized parameter customization of hardness, viscosity and curing time to match diverse radar and antenna encapsulation scenarios.
Production Process
We adopt dust-free standardized production and strict RF loss testing. Every batch is verified for radar transparency and dielectric stability to guarantee reliable antenna beam integrity protection.
FAQ
Q1: What is the core advantage of this potting silicone?
A: It provides professional RF transparent dielectric encapsulation and low loss module potting, realizing
long-term antenna beam integrity protection without signal attenuation.
Q2: Will temperature changes affect radar signal permeability?
A: No. It maintains stable low dielectric loss and radar transparency in -60℃ to 220℃ wide temperature range.
Q3: Does colloidal stratification affect RF performance?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and its low-loss and radar transparent
performance remain completely unchanged.