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Home> Products> Electronic Potting Compound> Low Viscosity Electronic Potting Compound
Low Viscosity Electronic Potting Compound
Low Viscosity Electronic Potting Compound
Low Viscosity Electronic Potting Compound
Low Viscosity Electronic Potting Compound
Low Viscosity Electronic Potting Compound
Low Viscosity Electronic Potting Compound

Low Viscosity Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
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Product Attributes

Model No.: HY-9025

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-5
Product Description
HONG YE SILICONE’s Low Viscosity Electronic Potting Compound is a high-fluidity bubble free module Potting Compound developed for compact and dense electronic structures. It features easy flow thin section encapsulation and delivers reliable tight space penetration protection. This low-viscosity silicone maintains excellent fluidity before curing, fully penetrating tiny gaps and thin-layer structures. It effectively solves incomplete filling and bubble residue issues of ordinary potting materials, ensuring full coverage and seamless protection for miniaturized electronic modules.
 
HY-factory

Product Overview

Available in addition and condensation curing formulas, this fluid Electronic potting compound is dedicated to precise encapsulation and gap filling of compact electronic components. It offers superior adhesion and thermal stability for PCB, PC, PMMA, CPU and various metal substrates including aluminum, copper and stainless steel. Cured silicone operates stably at -60℃ to 220℃, absorbs thermal cycling stress, and protects internal chips and bonding wires with low volatility and high structural stability.

Technical Specifications

Formulated with ultra-fine filler technology, this bubble free module potting compound delivers ultra-low viscosity and outstanding fluidity. It boasts excellent ozone resistance and chemical erosion resistance, retaining stable heat dissipation performance similar to our classic Thermally Conductive Potting Compound. Viscosity, curing speed and operating time are adjustable to meet diverse easy flow thin section encapsulation and tight space penetration protection requirements.
 
electronic silicone

Product Features & Advantages

This low-viscosity silicone outperforms conventional high-viscosity Silicone Encapsulant for miniaturized electronics:
1. Ultra-High Fluidity: Realize easy flow thin section encapsulation to freely penetrate ultra-narrow gaps and thin component layers without manual auxiliary filling.
2. Bubble-Free Encapsulation: Professional bubble free module potting compound formula reduces air residue, achieving seamless and flawless encapsulation effect.
3. Precision Gap Protection: Provide stable tight space penetration protection for dense circuit structures to avoid local exposure and incomplete protection.
4. Comprehensive Environmental Resistance: Integrate waterproof, insulation, dustproof and wide-temperature resistance for long-term stable component protection.

Application Scenarios

As a precision Electronic Encapsulation Adhesive, it is widely used for miniaturized sensors, compact circuit boards, micro power modules and high-density electronic equipment. It improves encapsulation yield and product consistency, effectively reducing defective rates caused by unfilled gaps and bubble defects for electronic manufacturers.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir Part A evenly and shake Part B thoroughly to ensure uniform dispersion of fine functional fillers.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to guarantee stable fluidity and curing performance.
3. Vacuum Defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3 minutes to remove tiny bubbles for purer encapsulation.
4. Curing Operation: Support room temperature or heating curing with 24-hour full curing cycle; stable environment ensures optimal penetration and filling effect.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards. This low viscosity potting compound meets global precision electronic manufacturing industry specifications.

Customization Options

We provide personalized parameter customization. Clients can adjust viscosity, fluidity and curing time to develop exclusive tight space penetration protection solutions.

Production Process

We adopt dust-free precision production and strict fluidity testing. Every batch is verified for penetration and bubble-free performance to ensure qualified easy flow thin section encapsulation quality.

FAQ

Q1: What scenarios is this low-viscosity potting silicone suitable for?
A: It is a professional bubble free module potting compound with easy flow thin section encapsulation capability,
providing perfect tight space penetration protection for compact and high-density electronic modules.
Q2: Will colloid stratification affect fluidity and filling effect?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and its fluidity, penetration and encapsulation
performance remain unchanged.
Q3: Can it completely eliminate tiny internal bubbles?
A: Yes. Combined with vacuum defoaming process, its ultra-high fluidity effectively discharges residual air to achieve
bubble-free seamless encapsulation.
 
 
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