HONG YE SILICONE’s High Flexibility Electronic Potting Silicone is a professional bendable cured encapsulation layer designed for dynamic electronic operating environments. It specializes in dynamic stress absorbing module potting and long-term crack prevention flexible protection. This modified silicone retains ultra-high elasticity after full curing, effectively resisting bending, stretching and thermal deformation stress. It avoids colloid cracking and component damage caused by frequent temperature changes and mechanical shaking, ideal for flexible and vibration-prone electronic modules.
Product Overview
Available in addition and condensation curing formulas, this elastic Electronic Potting Compound is widely used for encapsulation, sealing and shockproof filling of precision electronic components. It delivers excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. Cured silicone stably operates at -60℃ to 220℃, absorbs internal thermal cycling stress, and protects chips and bonding wires with low volatility and super flexible toughness. Technical Specifications
Featuring high-elastic molecular structure, this bendable cured encapsulation layer has outstanding ozone resistance and chemical erosion resistance. It maintains stable heat dissipation performance consistent with our classic Thermally Conductive Potting Compound. Cured hardness, viscosity and operating time are adjustable to meet customized dynamic stress absorbing module potting and crack prevention flexible protection requirements.
Product Features & Advantages
This high-flexibility silicone outperforms rigid conventional Silicone Encapsulant for dynamic electronics: 1. Ultra-High Flexibility: Forms a tough bendable cured encapsulation layer that adapts to device bending and micro-deformation without cracking.
2. Dynamic Stress Absorption: Realize efficient dynamic stress absorbing module potting to buffer thermal expansion and mechanical vibration impact.
3. Long-Term Crack Resistance: Provide reliable crack prevention flexible protection to solve aging cracking problems of rigid potting materials.
4. Comprehensive Protection: Integrate waterproof, insulation, dustproof and wide-temperature resistance for full-range electronic component protection.
Application Scenarios
As a flexible functionalElectronic Encapsulation Adhesive, it is widely applied to wearable electronics, flexible circuit boards, vehicle-mounted vibrating modules and portable precision devices. It effectively reduces component cracking failure rates, extends equipment service life and cuts manufacturers’ after-sales maintenance costs. Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A evenly to homogenize elastic functional fillers and shake Part B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable flexibility and curing performance.
3. Vacuum Defoaming: Place mixed glue in a 0.01MPa vacuum container for 3 minutes to remove bubbles for seamless flexible encapsulation.
4. Curing Operation: Support room temperature or heating curing with 24-hour full curing cycle; ambient temperature and humidity affect overall curing efficiency.
Certifications and Compliance
All HONG YE SILICONE products pass ISO9001, CE and RoHS international certifications. This high-flexibility potting silicone complies with global precision and flexible electronic industry standards.
Customization Options
We provide personalized parameter customization. Clients can adjust elasticity, hardness and curing speed to develop exclusive crack prevention flexible protection solutions.
Production Process
We adopt dust-free standardized production and strict flexibility & anti-cracking testing. Every batch is inspected for elasticity and stress resistance to guarantee qualified dynamic stress absorbing module potting quality.
FAQ
Q1: What is the core advantage over ordinary rigid potting silicone?
A: It forms a bendable cured encapsulation layer, realizing dynamic stress absorbing module potting and
delivering durable crack prevention flexible protection for dynamically working electronics.
Q2: Will colloidal stratification affect flexible performance?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and the elasticity and anti-cracking
performance remain completely unchanged.
Q3: Is it suitable for long-term vibrating electronic equipment?
A: Yes. Its excellent flexibility and stress absorption capability perfectly adapt to long-term vibration and
temperature cycle working conditions.
Shenzhen Hong Ye Jie Technology Co., Ltd
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