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Home> Products> Electronic Potting Compound> General Purpose Electronic Potting Compound
General Purpose Electronic Potting Compound
General Purpose Electronic Potting Compound
General Purpose Electronic Potting Compound
General Purpose Electronic Potting Compound
General Purpose Electronic Potting Compound
General Purpose Electronic Potting Compound

General Purpose Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9010

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic potting silicone
Product Description
HONG YE SILICONE’s General Purpose Electronic Potting Compound is a cost-effective multipurpose protective encapsulation material designed for universal electronic insulation and sealing tasks. It delivers reliable standard grade module potting and all-round versatile circuit board protection. Balancing stable performance and high adaptability, this two-part silicone suits most civilian and industrial electronic sealing scenarios, providing long-term waterproof, insulating and anti-aging protection for conventional circuit modules.
 
package2

Product Overview

Available in addition and condensation curing formulas, this universal Electronic Potting Compound is widely used for encapsulation, filling and pressure resistance protection of common electronic components. It offers excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel surfaces. Cured silicone works stably from -60℃ to 220℃, absorbs thermal cycling stress, and protects internal chips and bonding wires with low volatility and high structural strength.

Technical Specifications

As a standard grade module potting material, this multipurpose protective encapsulation material features low volatile content, outstanding ozone resistance and chemical erosion resistance. It retains steady heat dissipation performance similar to our classic Thermally Conductive Potting Compound. Viscosity, cured hardness and operating time can be adjusted to match diverse general electronic encapsulation demands.
 
electronic silicone

Product Features & Advantages

This versatile silicone stands out among ordinary industrial Silicone Encapsulant with balanced performance and cost efficiency:
1. Universal Compatibility: Professional multipurpose protective encapsulation material adapts to most common electronic substrates and conventional working environments.
2. Balanced Comprehensive Performance: Realize standard grade module potting integrating waterproof, dustproof, insulation, shockproof and wide temperature resistance.
3. Cost-Effective Protection: Provide stable versatile circuit board protection with stable quality and affordable cost for mass production projects.
4. High Bonding Strength: Features low volatility and excellent adhesion to multiple metals and plastic circuit board materials.

Application Scenarios

As a mainstream general-grade Electronic Encapsulation Adhesive, it is ideal for household appliances, conventional industrial control circuits, ordinary LED modules and consumer electronic components. It effectively reduces circuit failure rates caused by moisture, dust and temperature changes, lowering overall production and maintenance costs for electronic manufacturers.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir Part A evenly to homogenize settled fillers and shake Part B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly according to standard weight ratio to ensure stable curing and protective performance.
3. Vacuum Defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3 minutes to remove bubbles for seamless encapsulation.
4. Curing Operation: Cure at room temperature or elevated temperature; full curing takes 24 hours, with ambient temperature and humidity affecting curing efficiency.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards. This general purpose potting compound meets global mainstream civilian and industrial electronic safety specifications.

Customization Options

Customizable parameters including viscosity, cured hardness and operating time are available to meet personalized standard grade module potting and versatile circuit board protection requirements.

Production Process

We implement standardized dust-free production and strict performance testing for every batch. Finished products are inspected for adhesion, temperature resistance and insulation to guarantee qualified multipurpose protective encapsulation quality.

FAQ

Q1: What are the core application advantages of this general-purpose potting silicone?
A: It is a multipurpose protective encapsulation material supporting standard grade module potting, providing
cost-effective and versatile circuit board protection for most common electronic devices.
Q2: Does colloidal stratification affect usage performance?
A: Stratification is a normal storage phenomenon. Evenly stirring before use will not change its original protective
and bonding performance.
Q3: Is it suitable for mass production electronic encapsulation?
A: Yes. With stable performance and simple operation, it is perfectly suitable for large-batch general electronic
module encapsulation projects.
 
 
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