Product Overview
Available in addition and condensation curing formulas, this flexible Electronic Potting Compound is designed for sealing, filling and shockproof encapsulation of vibration-prone electronic modules. It delivers excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. Operating stably from -60℃ to 220℃, it absorbs internal thermal cycling stress and protects chips and bonding wires, featuring low volatility and ultra-soft elastomer toughness. Technical Specifications
Formulated with high-elastic soft molecular structure, this soft elastomer encapsulation compound boasts outstanding ozone resistance and chemical erosion resistance. It maintains stable heat dissipation performance consistent with our classic Thermally Conductive Potting Compound. Viscosity, softness grade and curing time are customizable to meet diverse stress relieving module potting and vibration absorbing board protection demands.
Product Features & Advantages
This flexible silicone outperforms rigid conventional Silicone Encapsulant for dynamic industrial electronics: 1. Ultra-Soft Elastomer Performance: Unique soft elastomer encapsulation compound formula avoids component extrusion damage caused by rigid curing.
2. Effective Stress Relief: Realize precise stress relieving module potting to offset thermal expansion and contraction stress in high-low temperature cycles.
3. Superior Vibration Resistance: Provide long-term vibration absorbing board protection for devices working in vibrating and shaking scenarios.
4. Comprehensive Barrier Protection: Integrate waterproof, insulating, dustproof and corrosion-resistant properties for full-range electronic protection.
Application Scenarios
As a high-elasticity Electronic Encapsulation Adhesive, it is widely used for vehicle-mounted electronics, wearable devices, industrial vibrating control modules and portable precision electronics. It greatly reduces component cracking and board falling failure rates, cutting equipment maintenance costs and improving product durability for global manufacturers. Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A evenly to disperse elastic functional fillers and shake Part B thoroughly for uniform mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable softness and vibration resistance.
3. Vacuum Defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3 minutes to remove bubbles for seamless flexible encapsulation.
4. Curing Operation: Support room temperature or heating curing with 24-hour full curing cycle; stable environment guarantees optimal flexible protection performance.
Certifications and Compliance
All HONG YE SILICONE products pass ISO9001, CE and RoHS international certifications. This flexible potting silicone complies with global precision electronic and automotive electronic industry safety standards.
Customization Options
We offer personalized customization of viscosity, softness and operating time to develop exclusive stress relieving module potting solutions for unique application scenarios.
Production Process
We adopt dust-free standardized production and strict vibration & flexibility testing. Every batch is inspected for elasticity, adhesion and stress relief performance to ensure qualified soft elastomer encapsulation quality.
FAQ
Q1: What is the biggest advantage over ordinary hard potting silicone?
A: It is a soft elastomer encapsulation compound that realizes stress relieving module potting and delivers
durable vibration absorbing board protection without squeezing precision components.
Q2: Will colloidal stratification affect flexible performance?
A: Stratification is a normal storage trait. Stir evenly before use, and its elasticity and shock absorption
performance remain completely unchanged.
Q3: Is it suitable for long-term vibrating vehicle electronic modules?
A: Yes. Its excellent flexibility and vibration resistance perfectly adapt to continuous vibration environments
for stable long-term module protection.