HONG YE SILICONE’s High Precision Sensor Electronic Potting Compound is a professional piezo insensitive encapsulation material customized for precision sensing devices. It supports high-stability drift free module potting and provides reliable signal integrity preservation protection. This low-stress Silicone Potting Compound avoids signal deviation and data drift caused by encapsulation stress, perfectly solving the precision attenuation problem of traditional potting adhesives and ensuring long-term accurate sensor output in industrial and smart device applications.
Product Overview
Available in addition and condensation curing formulas, this precision-grade Electronic Potting Compound focuses on stress-free encapsulation, sealing and gap filling for high-precision sensors. It delivers ultra-stable adhesion and thermal stability for PCB, PC, PMMA, CPU and various metal substrates including aluminum, copper and stainless steel. Cured silicone operates stably from -60℃ to 220℃, absorbs thermal cycling stress without squeezing internal sensitive components, and fully protects chips and sensing structures while retaining original signal accuracy. Technical Specifications
Formulated with low-stress piezo-insensitive molecular structure, this advanced encapsulation material features low volatile content, excellent ozone and chemical erosion resistance. It maintains balanced heat dissipation performance consistent with our classicThermally Conductive Potting Compound. Customizable viscosity, hardness and curing shrinkage meet strict drift free module potting and signal integrity preservation protection requirements for precision sensors.
Product Features & Advantages
This sensor-specific silicone outperforms ordinary industrial Silicone Encapsulant in precision device protection: 1. Piezo Insensitive Performance: Adopt professional piezo insensitive encapsulation material formula with zero interference to sensor piezoelectric induction structure.
2. Zero Drift Encapsulation: Realize stable drift free module potting to prevent data deviation and precision attenuation after long-term operation.
3. Complete Signal Protection: Provide all-round signal integrity preservation protection to maintain original sensing accuracy and improve device detection stability.
4. Low-Stress & Durable: Integrate insulation, waterproof and wide temperature resistance, avoiding component damage caused by curing shrinkage stress.
Application Scenarios
As a high-precision Electronic Encapsulation Adhesive, this product is widely used for pressure sensors, temperature sensors, photoelectric sensors and smart detection modules. It effectively reduces sensor failure and data drift rates, greatly improving product qualification rate and service life for precision electronic manufacturers. Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A evenly to disperse precision functional fillers and shake Part B thoroughly for uniform stress-free formulation.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to guarantee stable piezo-insensitive and zero-drift performance.
3. Vacuum Defoaming: Place blended silicone in a 0.01MPa vacuum container for 3 minutes to remove tiny bubbles and avoid local stress concentration.
4. Curing Operation: Support room temperature or heating curing with 24-hour full curing cycle; constant temperature and humidity ensure optimal signal protection effect.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards. This precision sensor potting compound meets global high-precision electronic industry manufacturing specifications.
Customization Options
We provide personalized customization. Clients can adjust viscosity, hardness and curing stress to develop exclusive signal integrity preservation protection solutions.
Production Process
We adopt dust-free precision production and strict signal stability testing. Every batch is verified for piezo insensitivity and zero-drift performance to ensure qualified high-precision encapsulation quality.
FAQ
Q1: Why is it suitable for precision sensor encapsulation?
A: It is a piezo insensitive encapsulation material that supports drift free module potting and delivers professional
signal integrity preservation protection without interfering sensor data.
Q2: Will colloid stratification affect sensing protection performance?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and its zero-drift and signal stability
performance remain unchanged.
Q3: Can it solve sensor temperature drift failure?
A: Yes. Its low-stress and temperature-resistant structure effectively offsets thermal cycling stress, greatly
reducing sensor temperature drift failure.
Shenzhen Hong Ye Jie Technology Co., Ltd
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