HONG YE SILICONE’s Low Temperature Curing Electronic Potting Silicone is a specialized cold cure encapsulation process silicone designed for fragile and heat-sensitive electronic devices. It supports professional heat sensitive component module potting and features stable low exotherm reaction protection during curing. This two-part silicone avoids high-temperature damage to delicate components, retaining excellent insulation, waterproofing and wide-temperature stability. It is an ideal solution for precision electronics that cannot withstand high-temperature baking and thermal impact.
Product Overview
Available in addition and condensation curing formulas, this low-temperature curing Electronic Potting Compound focuses on encapsulation, sealing and gap filling for precision electronic modules. It delivers outstanding adhesion and thermal stability on PCB, PC, PMMA, CPU and multiple metal substrates including aluminum, copper and stainless steel. The cured silicone operates stably from -60℃ to 220℃, absorbs thermal cycling stress, and protects chips and bonding wires without generating excessive heat during curing. Technical Specifications
Optimized with low-temperature activated formula, this silicone adopts a reliable cold cure encapsulation process with ultra-low curing heat output. It features low volatile content, excellent ozone resistance and chemical erosion resistance. Its heat dissipation performance is comparable to our mature Thermally Conductive Potting Compound. We can customize viscosity, curing temperature threshold and operation time to meet diverse heat sensitive component module potting requirements.
Product Features & Advantages
This low-temperature curing silicone uniquely caters to precision electronic packaging compared with conventional potting materials:
1. Cold Cure Encapsulation: Adopts advanced cold cure encapsulation process, eliminating high-temperature baking procedures and reducing production energy consumption.
2. Heat-Sensitive Compatibility: Achieve safe heat sensitive component module potting, preventing thermal deformation and burnout of fragile precision parts.
3. Low Exotherm Performance: Provide stable low exotherm reaction protection with mild curing reaction, no local high temperature or component damage.
4. Comprehensive Protection: Integrate waterproof, shockproof, insulation and temperature resistance to ensure long-term stable operation of encapsulated devices.
Application Scenarios
As a precision-grade Electronic Encapsulation Adhesive, this product is widely applied to micro sensors, fragile chip modules, low-temperature resistant consumer electronics and precision automotive electronic components. It effectively reduces product defective rates caused by thermal curing, replacing traditional high-temperature curing Silicone Encapsulant for delicate device packaging. Step-by-Step Usage Process
1. Pre-Stirring: Evenly stir Part A to homogenize internal functional fillers and fully shake Part B to ensure uniform composition.
2. Accurate Proportioning: Mix A and B components strictly per standard weight ratio to maintain stable low-temperature curing performance.
3. Vacuum Defoaming: Place blended silicone in a 0.01MPa vacuum container for 3 minutes to remove bubbles before perfusion.
4. Low-Temperature Curing: Complete curing via cold cure encapsulation process at low or room temperature; full curing takes 24 hours with mild reaction for heat-sensitive components.
Certifications and Compliance
All HONG YE SILICONE products pass ISO9001, CE and RoHS international certifications. This low-temperature curing potting silicone complies with global precision electronic manufacturing safety standards.
Customization Options
We support personalized customization. Clients can adjust viscosity, cured hardness and curing temperature to develop exclusive low exotherm reaction protection encapsulation solutions.
Production Process
We adopt dust-free standardized production and strict low-temperature curing testing. Every batch undergoes exothermic reaction detection to ensure qualified cold cure encapsulation process and reliable heat sensitive component module potting performance.
FAQ
Q1: What is the biggest advantage of this product?
A: It uses a professional cold cure encapsulation process, supports heat sensitive component module potting,
and provides stable low exotherm reaction protection to avoid thermal damage to precision electronics.
Q2: Will colloidal stratification affect curing performance?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and its low-temperature curing effect
and protective performance remain unchanged.
Q3: Is it suitable for ultra-fragile electronic chips?
A: Yes. The mild low-temperature curing process produces no excessive heat, fully meeting the packaging requirements
of ultra-fragile heat-sensitive chip components.
Shenzhen Hong Ye Jie Technology Co., Ltd
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