Product Overview
Available in addition and condensation curing formulas, this multi-functional Electronic Potting Compound focuses on encapsulation, sealing and filling of vibration-prone electronic components. It delivers exceptional bonding strength and thermal stability on PCB, PC, PMMA, CPU, aluminum, copper and stainless steel surfaces. The cured silicone operates stably at -60℃ to 220℃, absorbs thermal cycling stress and mechanical vibration energy, and fully protects delicate chips and bonding wires from long-term dynamic impact damage. Technical Specifications
Optimized with high-toughness adhesive formula, this shock absorbing strong bonding encapsulation material features low volatile content, outstanding ozone resistance and chemical erosion resistance. It realizes efficient mechanical energy dissipation module potting while retaining basic heat dissipation performance equivalent to our classic Thermally Conductive Potting Compound. Product viscosity, hardness and bonding strength can be customized to fit diverse rugged environment survival protection demands.
Product Features & Advantages
This high-adhesion shock-dampening silicone outperforms ordinary potting products for dynamic working scenarios:
1. Superior Vibration Resistance: Achieve professional mechanical energy dissipation module potting to buffer continuous vibration and mechanical shock.
2. Ultra-High Bonding Strength: Adopt shock absorbing strong bonding encapsulation technology to avoid delamination and peeling under frequent vibration.
3. Rugged Environment Adaptability: Provide stable rugged environment survival protection against vibration, dust, moisture and temperature fluctuation.
4. Multi-Material Compatibility: Perfectly bonds with various metals and plastic substrates, with integrated insulation and anti-corrosion performance.
Application Scenarios
As a durable industrial-grade Electronic Encapsulation Adhesive, this product is widely used for automotive electronics, outdoor monitoring modules, transportation equipment circuits and industrial vibration machinery components. It greatly reduces equipment failure rates caused by vibration, serving as an upgraded alternative to ordinary low-adhesion Silicone Encapsulant. Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A to evenly disperse functional fillers and shake Part B thoroughly to ensure uniform composition.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to maintain stable adhesion and vibration dampening performance.
3. Vacuum Defoaming: Place blended silicone in a 0.01MPa vacuum container for 3 minutes to remove bubbles for tight encapsulation.
4. Curing Operation: Support room temperature or heating curing; full curing takes 24 hours, with stable ambient conditions ensuring optimal toughness and bonding effect.
Certifications and Compliance
All HONG YE SILICONE products pass ISO9001, CE and RoHS international certifications. This vibration dampening potting silicone complies with global industrial electronic manufacturing safety standards.
Customization Options
We offer personalized customization. Clients can adjust viscosity, cured hardness and adhesion strength to develop exclusive rugged environment survival protection encapsulation solutions.
Production Process
We adopt dust-free standardized production and strict vibration aging testing. Every batch undergoes adhesion and shock resistance detection to ensure qualified shock absorbing strong bonding encapsulation and stable mechanical energy dissipation module potting performance.
FAQ
Q1: What is the core advantage for industrial vibrating scenarios?
A: It realizes mechanical energy dissipation module potting, provides shock absorbing strong bonding
encapsulation, and delivers long-term rugged environment survival protection against vibration fatigue damage.
Q2: Will colloid stratification affect adhesion performance?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and its high adhesion and vibration
dampening properties will not be affected.
Q3: Is it suitable for long-term running automotive electronics?
A: Yes. Its excellent shock absorption and high bonding strength effectively resist vehicle jitter, perfectly
protecting automotive electronic modules.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
