Product Overview
Available in addition and condensation curing formulas, this high-temperature resistant Electronic Potting Compound specializes in encapsulation, sealing and pressure-resistant filling of heat-sensitive electronic modules. It boasts superior adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. Cured silicone works steadily from -60℃ to 220℃, absorbing internal stress generated by frequent temperature changes to protect chips and bonding wires without cracking or debonding. Technical Specifications
Formulated with high-temperature resistant flexible resin, this extreme heat resistant encapsulation material maintains soft and tough properties under continuous high-temperature working conditions. It features low volatile content, outstanding ozone resistance and chemical erosion resistance. Its heat dissipation performance is comparable to our classic Thermally Conductive Potting Compound. Customizable viscosity, hardness and pot life meet diverse thermal cycle flexible module potting requirements.
Product Features & Advantages
This flexible high-temperature silicone stands out from ordinary rigid potting products with unique industrial adaptability:
1. Extreme Temperature Resistance: As a premium extreme heat resistant encapsulation material, it withstands long-term high-temperature operation and severe cold environments.
2. Thermal Cycle Flexibility: Realize stable thermal cycle flexible module potting to buffer repeated expansion and contraction stress.
3. Durable High-Temp Protection: Provide lasting high temp resilience protection, avoiding cracking, aging and peeling under temperature cycling.
4. Multi-Substrate Adhesion: Features high bonding strength on various metals and plastic substrates, with integrated waterproof, insulating and shockproof performance.
Application Scenarios
As a high-performance Electronic Encapsulation Adhesive, this product is widely used for automotive electronics, industrial control modules, high-power LED equipment and outdoor electrical devices. It effectively reduces failure rates caused by temperature changes, serving as an ideal upgraded alternative to ordinary temperature-resistant Silicone Encapsulant. Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A to evenly disperse temperature-resistant fillers and shake Part B thoroughly for uniform composition.
2. Accurate Proportioning: Mix A and B components strictly according to standard weight ratio to retain stable flexibility and high-temperature resistance.
3. Vacuum Defoaming: Place blended silicone in a 0.01MPa vacuum container for 3 minutes to remove bubbles before perfusion.
4. Curing Operation: Support room temperature or heating curing; full curing takes 24 hours, with ambient temperature and humidity affecting the final curing effect.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards. This high-temperature flexible potting silicone meets global industrial electronic manufacturing and export specifications.
Customization Options
We support personalized customization. Clients can adjust product viscosity, cured hardness and thermal resistance to match exclusive high temp resilience protection encapsulation solutions.
Production Process
We adopt standardized dust-free production and strict temperature cycle aging tests. Every batch is verified for high-temperature flexibility to ensure qualified extreme heat resistant encapsulation and thermal cycle flexible module potting performance.
FAQ
Q1: What is the core advantage over ordinary potting silicone?
A: It is an extreme heat resistant encapsulation material with thermal cycle flexible module potting capability,
providing professional high temp resilience protection against thermal stress damage.
Q2: Will colloidal stratification affect high-temperature performance?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and its flexibility and high-temperature
resistance will not be affected.
Q3: Is it suitable for outdoor high-temperature electronic equipment?
A: Yes. It adapts to extreme temperature changes and harsh outdoor environments, perfectly protecting
long-term operating outdoor electronic modules.
Shenzhen Hong Ye Jie Technology Co., Ltd
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