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Home> Products> Electronic Potting Compound> Particle Free Cleanroom Electronic Potting Silicone
Particle Free Cleanroom Electronic Potting Silicone
Particle Free Cleanroom Electronic Potting Silicone
Particle Free Cleanroom Electronic Potting Silicone
Particle Free Cleanroom Electronic Potting Silicone
Particle Free Cleanroom Electronic Potting Silicone
Particle Free Cleanroom Electronic Potting Silicone

Particle Free Cleanroom Electronic Potting Silicone

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9320

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-4
Product Description
HONG YE SILICONE’s Particle Free Cleanroom Electronic Potting Silicone is a premium impurity-free two-part silicone tailored for clean-room manufacturing environments. Adopting multi-stage filtration processed encapsulation grade formula, this material supports standardized ISO class compatible module potting and delivers reliable contamination controlled protection. Free of solid particles and micro debris, this specialized potting silicone integrates insulation, heat dissipation and temperature resistance, effectively eliminating particulate pollution to protect high-precision sensitive electronic and semiconductor components.
 
HY-silicone term

Product Overview

Available with addition-curing and condensation-curing formulas, this ultra-clean Electronic Potting Compound is designed for encapsulation, sealing and gap filling of cleanroom-grade electronics. It features excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. After curing, the silicone operates steadily at -60℃ to 220℃, relieves internal stress caused by thermal cycling, and safeguards delicate chips and bonding wires without generating particulate pollutants during service.

Technical Specifications

Produced via precise micropore filtration technology, this filtration processed encapsulation grade silicone realizes 100% particle-free performance. It owns low volatile content, outstanding ozone resistance and chemical erosion resistance. Its thermal dissipation capability matches our matureThermally Conductive Potting Compound. Our team can customize viscosity, hardness and curing cycle to meet diverse ISO class compatible module potting demands across multiple cleanroom grades.
 
electronic silicone

Product Features & Advantages

This particle-free silicone stands out from ordinary potting adhesives for high-standard cleanroom scenarios:
1. Zero Particle Impurity: Professional filtration processed encapsulation grade material to avoid micro-particle contamination for precision devices.
2. Cleanroom Compatibility: Achieve certified ISO class compatible module potting, suitable for multiple grades of dust-free workshops.
3. Pollution Isolation: Provide long-term contamination controlled protection to prevent short circuits and performance degradation caused by debris.
4. Comprehensive Protection: Combine waterproof, shockproof and insulation functions to balance cleanliness and all-round component protection.

Application Scenarios

As a cleanroom-exclusive Electronic Encapsulation Adhesive, this particle-free silicone is widely applied to semiconductor packaging, medical electronics, optical sensors and aerospace precision modules. It solves particulate contamination pain points of traditional Silicone Encapsulant, becoming the ideal encapsulation material for high-end dust-free manufacturing industries.

Step-by-Step Usage Process

1. Pre-Stirring: Stir Part A evenly inside a dust-free environment to disperse fillers and shake Part B fully to maintain unified performance.
2. Accurate Proportioning: Mix A and B components strictly following official weight ratio to retain stable particle-free characteristics.
3. Vacuum Defoaming: Place blended silicone in a 0.01MPa vacuum container for 3 minutes to remove bubbles before cleanroom perfusion.
4. Curing Operation: Support room-temperature or heating curing; full curing takes 24 hours, all operations are recommended to complete in corresponding ISO-grade clean spaces.

Certifications and Compliance

All HONG YE SILICONE products pass ISO9001, CE and RoHS certification. This cleanroom potting silicone complies with international cleanroom material standards and global high-precision electronic export specifications.

Customization Options

We provide personalized customization services. Clients can adjust adhesive viscosity, cured hardness and thermal conductivity to develop exclusive contamination controlled encapsulation solutions.

Production Process

We adopt Class 100 dust-free production and dual filtration treatment. Every batch undergoes particle detection to deliver qualified filtration processed encapsulation grade material and ISO class compatible module potting for global cleanroom electronic manufacturers.

FAQ

Q1: What makes this silicone different from regular Potting Compound?
A: It is a filtration processed encapsulation grade material, supports ISO class compatible module potting,
and provides professional contamination controlled protection for dust-free working scenarios.
Q2: Will colloidal stratification affect its cleanroom performance?
A: Stratification is a normal storage phenomenon. Stir evenly in a clean environment before use, and its
particle-free property will not be affected.
Q3: Which cleanroom classes is this product adaptable to?
A: This particle-free potting silicone can be customized to adapt to multiple ISO cleanroom grades for semiconductor
and medical electronic packaging.
 
 
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