HONG YE SILICONE’s High Bond Strength Primerless Electronic Potting Compound is an upgraded self-adhesive two-part silicone engineered to simplify electronic encapsulation workflows. Featuring adhesion promoted self priming encapsulation capability, this formula supports efficient no surface treatment module potting and delivers long-term reliable substrate grip protection. Eliminating extra primer coating procedures, this Potting Compound cuts raw material and labor costs while maintaining excellent insulation, temperature resistance and structural bonding performance for multi-substrate electronics.
Product Overview
Available in addition and condensation curing types, this high-adhesion Electronic potting compound is designed for encapsulation, sealing and compressive filling across diverse electronic components. It achieves powerful self-bonding performance on PCB, PC, PMMA, CPU and mainstream materials like aluminum, copper and stainless steel without primer. The cured material operates steadily from -60℃ to 220℃, absorbs thermal cycling stress, and protects chips and bonding wires while preventing delamination and peeling under complex working conditions.
Technical Specifications
Modified with internal high-efficiency adhesion enhancers, this primerless silicone realizes adhesion promoted self priming encapsulation without pre-treatment or base coating. It features low volatile content, superior ozone resistance and chemical stability. Its heat dissipation performance is identical to our flagship Thermally Conductive Potting Compound. Our team can customize bonding strength, viscosity and curing time to satisfy diversified no surface treatment module potting requirements.
Product Features & Advantages
This primerless potting compound outperforms traditional silicone products with process-oriented and cost-saving strengths:
1. Primer-Free Bonding: Realize adhesion promoted self priming encapsulation to skip primer coating and simplify production procedures.
2. Zero Pre-Treatment: Support direct no surface treatment module potting to reduce pre-processing time for mass assembly lines.
3. Ultra-High Adhesion: Offer stable reliable substrate grip protection to avoid delamination caused by temperature changes and vibration.
4. All-Round Protection: Integrate waterproof, shockproof and insulating properties to balance bonding stability and environmental barrier protection.
Application Scenarios
As a cost-saving Electronic Encapsulation Adhesive, this primerless potting silicone is widely used for power modules, consumer electronics, industrial circuit boards and multi-material composite devices. It optimizes assembly workflows and lowers operational costs, serving as an upgraded alternative to conventional primer-dependent Silicone Encapsulant. Step-by-Step Usage Process
1. Pre-Stirring: Evenly stir Part A to redistribute internal adhesive enhancers and fully shake Part B for uniform mixing.
2. Accurate Proportioning: Mix A and B components strictly per standard weight ratio to retain original high-bond primerless performance.
3. Vacuum Defoaming: Place blended silicone inside a 0.01MPa vacuum container for 3 minutes to remove bubbles before direct perfusion.
4. Curing Guide: Support room-temperature or heating curing with 24-hour full curing cycle; no extra surface polishing or priming required throughout the process.
Certifications and Compliance
All HONG YE SILICONE products hold ISO9001, CE and RoHS certifications. This high bond strength potting compound complies with international electronic manufacturing standards and global export regulations.
Customization Options
We provide exclusive personalized customization. Clients can adjust adhesive viscosity, bonding strength and hardness to match customized no-priming encapsulation solutions for specific substrates.
Production Process
We adopt dust-free standardized production and multi-substrate adhesion testing. Every batch undergoes peel strength detection to deliver qualified adhesion promoted self priming encapsulation and reliable substrate grip protection for global electronic manufacturers.
FAQ
Q1: What benefits does primerless design bring to production?
A: It realizes adhesion promoted self priming encapsulation, supports no surface treatment module potting,
saves primer cost and shortens overall production cycle.
Q2: Will colloidal stratification weaken bonding force?
A: Colloid stratification is normal during storage. Stir thoroughly before use, and its self-adhesion and comprehensive
protective performance remain unchanged.
Q3: Which substrates is this product suitable for?
A: It fits most common substrates including PCB, PC, PMMA, CPU and various metal materials, providing universal
reliable substrate grip protection.
Shenzhen Hong Ye Jie Technology Co., Ltd
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