Product Overview
Available in addition-curing and condensation-curing formulas, this barrier-grade Electronic Potting Compound is engineered for encapsulation, sealing and gap filling of electronics exposed to humid air. It delivers exceptional adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. The cured silicone maintains stable performance within -60℃~220℃, absorbs thermal cycling stress and protects chips and bonding wires from temperature fluctuation and persistent moisture erosion. Technical Specifications
Formulated with dense hydrophobic fillers, this material achieves industry-leading high WVTR resistant encapsulation to block water vapor molecular penetration. It features ultra-low volatile content, outstanding ozone resistance and chemical stability. Its heat dissipation performance is identical to our mature Thermally Conductive Potting Compound. Buyers can customize viscosity, hardness and curing time to fit diverse humidity seal module potting projects across multiple industries.
Product Features & Advantages
This vapor barrier silicone outperforms ordinary potting adhesives in high-humidity application scenarios:
1. Superior Vapor Barrier: Achieve high WVTR resistant encapsulation to form a dense hydrophobic film and block invasive moisture vapor.
2. Long-term Humidity Seal: Complete stable humidity seal module potting to stop dew condensation and eliminate hidden damp failure risks.
3. Damp Adaptability: Offer reliable damp environment survival protection for devices operating in coastal, underground and rainy regions.
4. All-round Protection: Combine shockproof, anti-corrosion and insulation characteristics to realize multi-dimensional electronic component protection.
Application Scenarios
As a waterproof-focused Electronic Encapsulation Adhesive, this silicone is widely used for outdoor LED lighting, marine electronics, bathroom appliances, buried control modules and coastal industrial equipment. It drastically reduces moisture-related defective rates, acting as the best upgraded alternative to conventional waterproof Silicone Encapsulant. Step-by-Step Usage Process
1. Pre-Stirring: Thoroughly stir Part A to redistribute hydrophobic fillers and shake Part B evenly before material proportioning.
2. Accurate Proportioning: Mix A and B components strictly per official weight ratio to retain intact moisture barrier performance.
3. Vacuum Defoaming: Place blended silicone inside a 0.01MPa vacuum container for 3 minutes to remove bubbles for seamless encapsulation.
4. Curing Operation: Support room-temperature or heating curing; full curing takes 24 hours, and ambient humidity will not negatively affect its final barrier performance.
Certifications and Compliance
All HONG YE SILICONE products are certified with ISO9001, CE and RoHS. This moisture vapor barrier potting silicone complies with international environmental standards and global electronic encapsulation export specifications.
Customization Options
We provide one-stop personalized customization. Clients can adjust adhesive viscosity, cured hardness and hydrophobic strength to satisfy exclusive damp environment encapsulation demands.
Production Process
We adopt dust-free sealed production and high-humidity aging testing. Every batch undergoes WVTR detection to deliver qualified high WVTR resistant encapsulation and damp environment survival protection for global electronic manufacturers.
FAQ
Q1: What’s the core advantage compared to regular waterproof silicone?
A: It supports high WVTR resistant encapsulation, realizes stable humidity seal module potting, and provides
durable damp environment survival protection in extreme humid climates.
Q2: Will colloidal stratification impact waterproof performance?
A: Stratification is a normal storage feature. Stir evenly before use, and its moisture vapor barrier capability will
not be affected.
Q3: Can it work continuously in 95% RH high humidity?
A: Yes. This product is specially optimized for high-humidity environments and can operate stably for years under
persistent high relative humidity conditions.