Product Overview
Offering addition curing and condensation curing formulas, this space-gradeElectronic Potting Compound specializes in high-precision encapsulation, sealing and pressure-resistant filling for sophisticated electronic devices. It achieves premium adhesion and thermal stability for PCB, PC, PMMA, CPU and various metal substrates including aluminum, copper and stainless steel. Cured material operates stably from -60℃ to 220℃, absorbing thermal cycling stress to protect chips and gold bonding wires in vacuum and alternating temperature scenarios. Technical Specifications
Purified via professional de-volatilization processing, this space-grade adhesive meets strict NASA low VOC encapsulation criteria with nearly zero outgassing residue. It possesses excellent ozone resistance and chemical inertness, maintaining stable physical properties in long-term vacuum environments. Its thermal management performance matches our flagship Thermally Conductive Potting Compound. Viscosity, hardness and curing duration can be customized for diverse aerospace encapsulation projects.
Product Features & Advantages
This space-grade silicone outperforms ordinary electronic potting adhesives for extreme industrial applications:
1. Ultra-low Outgassing: Complies with NASA low VOC encapsulation standards to eliminate volatile residue inside closed vacuum equipment.
2. Vacuum Stability: Realize long-term vacuum environment stable module potting without performance degradation or molecular precipitation.
3. Anti-contamination: Provide professional optical contamination prevention protection to safeguard optical sensors and precision lenses from atomized pollution.
4. Extreme Weather Resistance: Integrate insulation, waterproofing and shockproof properties to adapt to space and high-altitude extreme working conditions.
Application Scenarios
As an aerospace-grade Electronic Encapsulation Adhesive, this product is widely applied to satellite electronic units, aerospace control modules, vacuum laboratory equipment and high-end optical instruments. It effectively prevents volatile pollution and extends component service life, becoming the preferred high-standard Silicone Encapsulant for vacuum and aerospace manufacturing industries worldwide. Step-by-Step Usage Process
1. Pre-Stirring: Evenly stir Part A to disperse settled fillers and fully shake Part B to ensure uniform raw material composition.
2. Accurate Proportioning: Mix A and B components strictly per official weight ratio to retain ultra-low outgassing core characteristics.
3. Vacuum Defoaming: Place blended silicone inside a 0.01MPa vacuum container for 3 minutes to remove bubbles for flawless aerospace-grade encapsulation.
4. Curing Operation: Support room-temperature or heating curing; full curing takes 24 hours, with curing status affected by ambient temperature and humidity.
Certifications and Compliance
All HONG YE SILICONE products hold ISO9001, CE and RoHS certifications. This space-grade potting silicone follows NASA low-outgassing specifications, fully compliant with international aerospace and vacuum industry manufacturing standards.
Customization Options
We provide exclusive personalized customization. Clients can adjust viscosity, cured hardness, thermal conductivity and pot life to satisfy customized aerospace and vacuum environment encapsulation demands.
Production Process
We adopt dust-free ultra-clean production and multi-stage outgassing testing. Every batch undergoes vacuum aging detection to deliver stable vacuum environment stable module potting and optical contamination prevention protection for global aerospace clients.
FAQ
Q1: What makes this silicone suitable for space electronics?
A: It passes NASA low VOC encapsulation tests, supports vacuum environment stable module potting and
delivers efficient optical contamination prevention protection for precision space components.
Q2: Will colloidal stratification affect outgassing performance?
A: Colloid stratification is a normal storage trait. Stir evenly before use, and its ultra-low outgassing property will
not be compromised.
Q3: Is this product only available for aerospace scenarios?
A: No, it also fits vacuum labs, high-end optical devices and any precision equipment that requires low-outgassing
encapsulation.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
