Product Overview
Available in addition-cured and condensation-cured formulas, this high-strength Electronic Potting Compound focuses on encapsulation, sealing and compressive filling for exposed electronics with sharp edges. It features exceptional adhesion and thermal stability across PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. The cured material stably operates between -60℃ and 220℃, absorbs thermal cycling stress, and shields chips and bonding wires from temperature changes and mechanical tearing damage. Technical Specifications
Reinforced with high-strength elastomer fillers, this cut resistant elastomer encapsulation material effectively inhibits crack propagation under external extrusion and cutting force. It owns low volatile content, excellent ozone resistance and chemical erosion resistance. Its heat dissipation capability is comparable to our mature Thermally Conductive Potting Compound. Clients are allowed to customize tensile strength, viscosity and hardness to match diverse mechanical protection encapsulation demands.
Product Features & Advantages
Compared with ordinary silicone potting products, our high tear resistance silicone has irreplaceable mechanical advantages:
1. Superior Anti-tear Performance: Effectively block crack spreading, realizing top-tier high tear propagation resistance for long-term rugged use.
2. Cutting Resistance: Serve as cut resistant elastomer encapsulation to defend against sharp component edges and external scratch damage.
3. Mechanical Durability: Achieve stable mechanical abuse tolerant module potting to adapt to frequent vibration and extrusion working scenarios.
4. Dual Protection: Provide sharp edge puncture prevention protection together with waterproof, insulating and anti-corrosion comprehensive performance.
Application Scenarios
As a high-strength Electronic Encapsulation Adhesive, this product is widely used for automotive electronics, industrial control modules, exposed circuit boards and devices with sharp metal pins. It drastically reduces casing cracking and component piercing failure, acting as an upgraded high-strength alternative to conventional fragile Silicone Encapsulant. Step-by-Step Usage Process
1. Pre-Stirring: Fully stir Part A to homogenize internal reinforcing fillers and shake Part B evenly to guarantee uniform performance.
2. Accurate Proportioning: Mix A and B components strictly following standard weight ratio to retain high tear resistance characteristics.
3. Vacuum Defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3 minutes to eliminate bubbles before pouring encapsulation.
4. Curing Operation: Support room-temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.
Certifications and Compliance
All HONG YE SILICONE products pass ISO9001, CE and RoHS authoritative certifications. This high tear resistant potting silicone complies with global export standards and industrial electronic encapsulation specifications.
Customization Options
We provide personalized one-stop customization. Customers can adjust viscosity, tear strength, thermal conductivity and curing time to create exclusive high-mechanical-strength encapsulation solutions.
Production Process
We adopt dust-free sealed production and dual mechanical performance testing. Every batch undergoes tensile and tear testing to deliver qualified cut resistant elastomer encapsulation and sharp edge puncture prevention protection for global industrial electronic manufacturers.
FAQ
Q1: What is the core advantage of this potting silicone?
A: It features high tear propagation resistance, acts as cut resistant elastomer encapsulation, supports
mechanical abuse tolerant module potting and provides all-round sharp edge puncture prevention protection.
Q2: Will colloidal stratification reduce tear resistance?
A: Colloid stratification is a normal storage phenomenon. Stir evenly before use, and its mechanical strength
and protective performance remain unchanged.
Q3: Is it suitable for sharp-pin electronic modules?
A: Absolutely. Its unique anti-puncture design is specially developed for circuits with sharp pins and irregular
structural components.