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Home> Products> Electronic Potting Compound> Hydrolysis Resistant Electronic Potting Compound
Hydrolysis Resistant Electronic Potting Compound
Hydrolysis Resistant Electronic Potting Compound
Hydrolysis Resistant Electronic Potting Compound
Hydrolysis Resistant Electronic Potting Compound
Hydrolysis Resistant Electronic Potting Compound
Hydrolysis Resistant Electronic Potting Compound

Hydrolysis Resistant Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
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Product Attributes

Model No.: HY-230

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-6
Product Description
HONG YE SILICONE’s Hydrolysis Resistant Electronic Potting Compound is a high-durability two-part silicone tailored for high-humidity and moisture-prone working environments. Formulated as a premium moisture barrier encapsulation material, it delivers excellent humidity resistant module potting performance and long term reliability protection under extreme damp conditions. This multi-functional silicone integrates insulation, thermal dissipation and wide-temperature tolerance, effectively preventing adhesive degradation and circuit failure caused by hydrolysis for outdoor and wet-location electronic assemblies.
 
HY-SILICONE company

Product Overview

Available in addition curing and condensation curing types, this anti-hydrolysis Electronic Potting Compound supports comprehensive encapsulation, sealing and pressure-resistant filling for electronics. It features exceptional adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. Cured material operates stably from -60℃ to 220℃, absorbs thermal cycling stress, and protects chips and bonding wires from hydrolysis, corrosion and external physical damage.

Technical Specifications

Reinforced with anti-hydrolysis molecular structure, this moisture barrier encapsulation material resists water molecule penetration and chemical decomposition in long-term humid environments. It boasts low volatile content, superior ozone and chemical resistance, with thermal conductivity equivalent to our classic Thermally Conductive Potting Compound. Hardness, viscosity and operating pot life can be customized to satisfy high-humidity encapsulation requirements across various industries.
 
electronic silicone

Product Features & Advantages

Compared with ordinary silicone potting products, our hydrolysis-resistant compound has prominent differentiated advantages:
1. Advanced Anti-hydrolysis Ability: Unique molecular structure avoids adhesive softening and peeling in long-term humid scenarios.
2. Premium Moisture Isolation: Acts as a reliable moisture barrier encapsulation material to block water vapor and humid air invasion.
3. Humidity Adaptability: Realizes stable humidity resistant module potting, ideal for equipment exposed to fluctuating humidity.
4. Long Lifespan Protection: Provides consistent long term reliability protection to reduce replacement frequency and after-sales costs.

Application Scenarios

As a weather-resistant Electronic Encapsulation Adhesive, this product is widely used for outdoor LED devices, marine electronics, bathroom appliances, solar power modules and underground control circuits. Its powerful anti-hydrolysis performance minimizes electronic failure caused by dampness, greatly extending service life compared to conventional Silicone Encapsulant.

Step-by-Step Usage Process

1. Pre-stirring: Thoroughly stir Part A to redistribute settled fillers and shake Part B evenly before material mixing.
2. Accurate Proportioning: Mix two components strictly per official AB weight ratio to retain complete anti-hydrolysis properties.
3. Vacuum Defoaming: Place blended silicone inside a 0.01MPa vacuum container for 3 minutes to eliminate bubbles for seamless encapsulation.
4. Curing Treatment: Supports room-temperature or heating curing; full curing takes 24 hours, influenced by ambient temperature and humidity.

Certifications and Compliance

All HONG YE SILICONE products pass ISO9001, CE and RoHS certifications. This hydrolysis resistant potting compound complies with international export standards and stringent specifications for outdoor humid-environment electronic encapsulation.

Customization Options

We provide one-stop personalized customization. Clients can adjust viscosity, cured hardness, thermal conductivity and curing time to create exclusive anti-hydrolysis encapsulation solutions.

Production Process

We adopt dust-free sealed production and multi-stage environmental aging tests. Every batch undergoes high-humidity durability verification to deliver stable moisture barrier encapsulation material for global outdoor electronic manufacturers.

FAQ

Q1: What makes this potting compound different from regular silicone?
A: It features reinforced anti-hydrolysis structure, serving as a qualified moisture barrier encapsulation material
to achieve humidity resistant module potting and long term reliability protection in damp areas.
Q2: Will colloidal stratification affect hydrolysis resistance?
A: Colloid stratification is a normal storage phenomenon. Stir evenly before use, and its anti-hydrolysis and basic
protective performance remain intact.
Q3: Can mixed potting compound be stored for later use?
A: Sealed raw materials have long shelf life; mixed two-part compound cannot be stored and should be used up
in one construction session.
 
 
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