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Home> Products> Electronic Potting Compound> Low Shrinkage Electronic Potting Compound
Low Shrinkage Electronic Potting Compound
Low Shrinkage Electronic Potting Compound
Low Shrinkage Electronic Potting Compound
Low Shrinkage Electronic Potting Compound
Low Shrinkage Electronic Potting Compound
Low Shrinkage Electronic Potting Compound

Low Shrinkage Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
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Product Attributes

Model No.: HY-9320

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound1
Product Description
HONG YE SILICONE Low Shrinkage Electronic Potting Silicone is a precision-grade two-part silicone engineered as a dimensionally stable encapsulation material. This innovative formula realizes cure contraction minimized protection during full curing, supporting high-precision precision fit module potting for delicate electronic components. Beyond ultra-low shrinkage characteristics, it integrates insulation, waterproofing and temperature cycling resistance, effectively preventing component cracking and displacement caused by curing shrinkage for precision electronic assemblies.
 
HY-silicone term

Product Overview

Available in addition curing and condensation curing formulas, this high-precision Electronic Potting Compound is dedicated to encapsulation, sealing and pressure-resistant gap filling. It delivers excellent adhesion and thermal stability for PCB, PC, PMMA, CPU and diverse substrates including aluminum, copper and stainless steel. The cured silicone operates steadily within -60℃~220℃, absorbing thermal stress and protecting fragile chips and gold bonding wires from shrinkage-induced structural damage.

Technical Specifications

Reformulated with low-shrinkage polymer fillers, this dimensionally stable encapsulation material restricts curing shrinkage to an extremely low range. It eliminates internal stress generated during solidification while retaining low volatile content, ozone resistance and chemical stability. Its thermal conductivity performance is consistent with our mature Thermally Conductive Potting Compound. Viscosity, hardness and operating pot life are fully customizable to suit high-precision encapsulation scenarios.
 
electronic silicone

Product Features & Advantages

Different from conventional potting adhesives with high curing shrinkage, our product boasts irreplaceable technical advantages:
1. Ultra-low Shrinkage: Achieves cure contraction minimized protection to avoid structural deformation after complete solidification.
2. Dimensional Stability: Acts as a premium dimensionally stable encapsulation material to maintain original shape and encapsulation tightness long-term.
3. Precision Protection: Designed for precision fit module potting, perfectly compatible with tiny and sophisticated electronic parts.
4. Comprehensive Barrier Performance: Equipped with waterproof, dustproof, shockproof and insulating properties to adapt to multiple complex working environments.

Application Scenarios

As a high-precision Electronic Encapsulation Adhesive, this low-shrinkage silicone is widely applied to precision sensors, microchips, miniature automotive electronics and high-density PCB modules. It drastically reduces defective products caused by curing shrinkage stress, cutting manufacturing waste and after-sales maintenance costs compared with ordinary Silicone Encapsulant.

Step-by-Step Usage Process

1. Pre-stirring: Thoroughly stir Part A to homogenize settled fillers and shake Part B evenly before material proportioning.
2. Accurate Proportioning: Mix A and B components strictly by official weight ratio to maintain its low-shrinkage core performance.
3. Vacuum Defoaming: Place blended silicone inside a 0.01MPa vacuum container for 3 minutes to remove bubbles for seamless encapsulation.
4. Curing Treatment: Supports room-temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity conditions.

Certifications and Compliance

All HONG YE SILICONE products are certified with ISO9001, CE and RoHS. This low shrinkage potting silicone complies with international export standards and strict precision electronic encapsulation industry specifications.

Customization Options

We provide one-stop personalized customization. Clients can adjust shrinkage rate, cured hardness, adhesive viscosity and curing time to satisfy exclusive precision encapsulation demands.

Production Process

We adopt dust-free standardized production and multi-dimensional quality inspection. Every batch undergoes shrinkage testing and temperature cycling verification to deliver reliable dimensionally stable encapsulation material for global precision electronics buyers.

FAQ

Q1: Why choose low shrinkage potting silicone for precision electronics?
A: It provides cure contraction minimized protection and serves as dimensionally stable encapsulation material,
realizing zero-stress precision fit module potting for delicate components.
Q2: Will raw glue stratification impact shrinkage resistance?
A: Colloid stratification is a normal storage trait. Stir evenly before use, and its low-shrinkage and comprehensive
protective performance remain unchanged.
Q3: Can mixed two-part silicone be stored for later use?
A: Mixed compound cannot be stored long-term. Please finish potting procedures in one go to prevent performance
degradation.
 
 
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