HONG YE SILICONE High Elongation Electronic Potting Silicone is a high-flexibility two-part silicone material engineered for dynamically changing electronic environments. Featuring stretchable film encapsulation performance, this specialized potting adhesive delivers outstanding expansion accommodation protection. It supports flexible joint module potting to offset thermal expansion and mechanical deformation. This multi-functional silicone also integrates insulation, waterproof and temperature resistance features to safeguard delicate chips and bonding wires for flexible electronic assemblies.
Product Overview
Available in addition curing and condensation curing formulas, this ductile Electronic Potting Compound serves full-scale encapsulation, sealing and gap filling for various electronic components. It achieves stable adhesion and thermal compatibility with PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. Capable of continuous operation within -60℃~220℃, this high-elongation material absorbs thermal cycling stress and prevents cracking caused by frequent stretching and deformation of electronic modules. Technical Specifications
Reinforced with flexible polymer additives, this silicone boasts exceptional tensile properties and ultra-high breaking elongation. Its unique stretchable film encapsulation structure adapts to subtle component deformation without cracking. The cured compound features low volatile content, excellent ozone and chemical resistance, with thermal performance identical to our mainstream Thermally Conductive Potting Compound. Elongation rate, viscosity and curing time are fully customizable for flexible electronics projects.
Product Features & Advantages
Compared with traditional rigid potting adhesives, our high elongation silicone has irreplaceable technical advantages:
1. Superior Stretchability: Realizes premium stretchable film encapsulation, tolerating multi-direction stretching without tearing or debonding.
2. Deformation Adaptation: Provides professional expansion accommodation protection to eliminate failure risks from thermal expansion and cold contraction.
3. Flexible Joint Protection: Optimized for flexible joint module potting, perfectly matching bendable and wearable electronic structures.
4. All-round Barrier Performance: Combines waterproof, dustproof, anti-corrosion and insulating capabilities for long-term multi-scenario protection.
Application Scenarios
As a high-flexibility Electronic Encapsulation Adhesive, this product is widely used for wearable devices, flexible circuits, bending sensors, automotive wire joints and curved LED modules. It effectively reduces product scrapping caused by deformation cracking, cuts after-sales maintenance costs and extends the service life of flexible electronic finished products for global manufacturers. Step-by-Step Usage Process
1. Pre-stirring: Thoroughly stir Part A to redistribute settled fillers and shake Part B evenly before material mixing.
2. Proportional Mixing: Strictly follow the standard AB weight ratio to retain intact tensile strength and elongation performance after curing.
3. Vacuum Defoaming: Place mixed silicone inside a 0.01MPa vacuum container for 3 minutes to remove bubbles for flawless encapsulation.
4. Curing Treatment: Supports room-temperature or heating curing; full curing takes 24 hours, consistent with our universal Silicone Encapsulant product lineup. Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS certifications. This high-elongation potting silicone meets cross-border export standards and flexible electronic encapsulation industry specifications.
Customization Options
We provide personalized one-stop customization. Clients can adjust elongation rate, cured hardness, adhesive viscosity and operating pot life to satisfy exclusive flexible encapsulation demands.
Production Process
We adopt dust-free standardized production and multi-dimensional quality inspection. Every batch undergoes tensile testing and temperature cycling verification to ensure stable expansion accommodation protection for global industrial buyers.
FAQ
Q1: What scenarios is this high elongation silicone suitable for?
A: It is tailored for flexible electronics, offering stretchable film encapsulation and flexible joint module potting
to handle frequent deformation.
Q2: Will raw glue stratification impact tensile performance?
A: Colloid stratification is normal during storage. Stir evenly before use, and its elongation and expansion
accommodation protection will not be affected.
Q3: Can mixed two-part glue be stored for later use?
A: Mixed compound cannot be stored long-term. Please finish potting work in one time to avoid performance
degradation.
Shenzhen Hong Ye Jie Technology Co., Ltd
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