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Home> Products> Electronic Potting Compound> Sulfur Free Electronic Potting Compound
Sulfur Free Electronic Potting Compound
Sulfur Free Electronic Potting Compound
Sulfur Free Electronic Potting Compound
Sulfur Free Electronic Potting Compound
Sulfur Free Electronic Potting Compound
Sulfur Free Electronic Potting Compound

Sulfur Free Electronic Potting Compound

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-9305

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-4
Product Description
HONG YE SILICONE’s Sulfur Free Electronic Potting Compound is a high-purity contaminant-free silicone developed for sulfur-sensitive electronic components. It adopts advanced corrosion inhibiting encapsulation formula without sulfur and harmful volatile substances. This specialized material delivers reliable silver safe module potting and long-term metal preservative protection, effectively avoiding sulfidation and corrosion on silver-plated contacts and precision metal parts while offering insulation, waterproof and thermal cycling resistance for high-value electronics.
 
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Product Overview

Available in addition curing and condensation curing types, this premium Electronic Potting Compound supports encapsulation, sealing and pressure-resistant filling across various electronic devices. It features excellent adhesion and thermal stability for PCB, PC, PMMA, CPU and multiple substrates including aluminum, copper and stainless steel. Operating steadily between -60℃ and 220℃, this sulfur-free silicone absorbs internal stress caused by temperature changes and protects chips and bonding wires from mechanical and chemical damage.

Technical Specifications

Manufactured with sulfur-free raw materials and purified formulas, this material achieves zero sulfur content to eliminate metal tarnishing risks. It provides durable corrosion inhibiting encapsulation for vulnerable metal components and maintains stable performance in harsh environments. This product possesses balanced heat dissipation capacity identical to our mature Thermally Conductive Potting Compound. Hardness, viscosity and pot life can be customized to match sensitive electronic packaging standards.
 
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Product Features & Advantages

Different from ordinary silicone containing trace sulfur elements, our sulfur-free potting adhesive has irreplaceable industrial advantages:
1. Zero Sulfur Formula: High-purity formula realizes professional silver safe module potting, preventing silver layer sulfidation and circuit failure.
2. Anti-Corrosion Performance: Provides effective corrosion inhibiting encapsulation to extend the service life of multi-type metal structural parts.
3. Comprehensive Protection: Integrates dustproof, waterproof, shockproof and insulating properties to adapt to complex industrial working conditions.
4. Stable Metal Protection: Delivers all-round metal preservative protection without triggering chemical reactions with sensitive metal materials.

Application Scenarios

As a high-purity Electronic Encapsulation Adhesive, this sulfur-free silicone is ideal for relay components, silver-plated sensors, high-end audio electronics, precision automotive circuits and optical modules. Its dedicated silver safe module potting greatly reduces component failure induced by sulfur corrosion, lowering product defective rate and long-term operational costs for electronic manufacturers.

Step-by-Step Usage Process

1. Pre-stirring: Thoroughly stir Part A to homogenize settled fillers and fully shake Part B before mixing procedures.
2. Proportional Mixing: Follow official AB weight ratio strictly to retain intact sulfur-free and anti-corrosion characteristics after curing.
3. Vacuum Defoaming: Place blended compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles for seamless encapsulation.
4. Curing Treatment: Support room-temperature or heating curing; full curing takes 24 hours, consistent with our standard Silicone Encapsulant product series.

Certifications and Compliance

All HONG YE SILICONE products are certified with ISO9001, CE and RoHS. This sulfur-free potting compound complies with international export regulations and strict manufacturing standards for sulfur-sensitive electronic industries.

Customization Options

We provide one-stop personalized customization. Clients can adjust viscosity, cured hardness, thermal conductivity and operating time to create exclusive anti-corrosion encapsulation solutions.

Production Process

We adopt dust-free sealed production and multi-stage chemical detection. Every batch undergoes sulfur content testing and anti-corrosion verification to guarantee qualified metal preservative protection for global high-precision electronic buyers.

FAQ

Q1: Why choose sulfur free potting silicone for silver-plated parts?
A: It features corrosion inhibiting encapsulation to achieve silver safe module potting, preventing sulfidation and
providing permanent metal preservative protection.
Q2: Will colloidal stratification influence anti-corrosion performance?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and its sulfur-free and anti-corrosion
performance will not be affected.
Q3: How to store mixed sulfur-free silicone?
A: Sealed raw materials have long shelf life; mixed two-part compound should be used up in a single operation
to avoid performance degradation.
 
 
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