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Home> Products> Electronic Potting Compound> Low Dust Attraction Electronic Potting Silicone
Low Dust Attraction Electronic Potting Silicone
Low Dust Attraction Electronic Potting Silicone
Low Dust Attraction Electronic Potting Silicone
Low Dust Attraction Electronic Potting Silicone
Low Dust Attraction Electronic Potting Silicone
Low Dust Attraction Electronic Potting Silicone

Low Dust Attraction Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-9045

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting
Product Description
HONG YE SILICONE’s Low Dust Attraction Electronic Potting Silicone is a specialized clean-grade silicone developed for dust-sensitive electronic environments. Adopting advanced anti static surface encapsulation technology, this potting material delivers effective particle repellent protection. It supports professional cleanroom compatible module potting, preventing static dust accumulation. This dual-component silicone also provides waterproof, insulation and thermal cycling stress relief to maintain long-term cleanliness and stability for high-precision electronic assemblies.
 
HY-silicone term

Product Overview

Available in addition curing and condensation curing formulas, this premium Electronic Potting Compound is widely used for encapsulation, sealing and gap filling for various electronic components. It features excellent adhesion and thermal stability for PCB, PC, PMMA, CPU and mainstream substrates including aluminum, copper and stainless steel. It runs stably from -60℃ to 220℃, absorbing internal stress caused by temperature fluctuation and protecting chips and gold bonding wires against thermal damage.

Technical Specifications

Optimized with static-resistant formula, this material eliminates static charges to reduce surface dust adsorption. The cured layer achieves stable particle repellent protection without contaminating precision circuits. It retains outstanding thermal conductivity same as our mature Thermally Conductive Potting Compound, alongside low volatile content and great resistance to ozone and chemical corrosion. Hardness, viscosity and pot life can be customized for diverse clean-grade manufacturing environments.
 
electronic silicone

Product Features & Advantages

Compared with ordinary silicone prone to static dust absorption, our low-dust silicone possesses differentiated competitive advantages:
1. Anti-static Surface Treatment: Realizes durable anti static surface encapsulation to weaken static adsorption and block fine particle attachment.
2. Cleanroom Grade Performance: Supports standardized cleanroom compatible module potting, perfectly suitable for dust-free production workshops.
3. Comprehensive Protection: Integrates dustproof, waterproof, insulation and shockproof functions to adapt to complicated industrial operating conditions.
4. Superior Substrate Bonding: Firmly adheres to multiple metals and plastic materials to form a sealed and dust-free protective layer.

Application Scenarios

As a high-end Electronic Encapsulation Adhesive, this low dust attraction silicone is ideal for precision semiconductors, medical electronic devices, optical modules and cleanroom-produced LED components. Its reliable particle repellent protection effectively reduces circuit short-circuit risks caused by dust pollution, lowering product scrap rate and daily maintenance costs for electronic manufacturers.

Step-by-Step Usage Process

1. Pre-stirring: Evenly stir component A to fully mix settled fillers and shake component B sufficiently before proportioning.
2. Proportional Mixing: Comply with standard AB weight ratio to maintain stable anti-static and low-dust performance after curing.
3. Vacuum Defoaming: Place blended compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles before pouring.
4. Curing Method: Apply room-temperature or heating curing; full curing takes 24 hours, consistent with our universal Silicone Encapsulant product line.

Certifications and Compliance

All products of HONG YE SILICONE are certified with ISO9001, CE and RoHS. This low dust attraction potting silicone meets global export standards and strict cleanroom electronic encapsulation specifications.

Customization Options

We provide one-stop personalized customization. Clients can adjust static resistance grade, cured hardness, viscosity and working time to match exclusive clean-grade encapsulation projects.

Production Process

We adopt dust-free standardized production and multi-stage quality inspection. Every batch undergoes dust adsorption testing and anti-static detection to ensure stable cleanroom-grade protection for global industrial buyers.

FAQ

Q1: What makes this potting silicone different from regular glue?
A: It features anti static surface encapsulation and particle repellent protection, realizing cleanroom compatible
module potting to avoid dust buildup on encapsulated surfaces.
Q2: Will glue stratification affect its low-dust performance?
A: Colloid stratification is a normal storage feature. Stir evenly before use, and its anti-static and dust-repellent
performance will not be affected.
Q3: How to store mixed low dust attraction silicone?
A: Sealed raw materials enjoy long shelf life. Please use up mixed two-part compound at one time to prevent
performance degradation.
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