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Home> Products> Electronic Potting Compound> Low Water Absorption Electronic Potting Compound
Low Water Absorption Electronic Potting Compound
Low Water Absorption Electronic Potting Compound
Low Water Absorption Electronic Potting Compound
Low Water Absorption Electronic Potting Compound
Low Water Absorption Electronic Potting Compound
Low Water Absorption Electronic Potting Compound

Low Water Absorption Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9030

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound1
Product Description
HONG YE SILICONE Low Water Absorption Electronic Potting Compound is a high-performance waterproof silicone material engineered for humid and underwater electronic environments. This specialized Low Water Absorption Electronic Potting Compound adopts advanced hydrophobic barrier encapsulation technology to block liquid penetration. It delivers long term insulation protection for sensitive circuits, combining thermal dissipation and anti-aging features to solve common failures caused by moisture erosion in electronic packaging.
 
package4

Product Overview

Available in addition curing and condensation curing types, our premium Electronic potting compound is widely adopted for encapsulation, sealing and gap filling across various electronic components. It features excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. Capable of stable operation from -60℃ to 220℃, this silicone relieves thermal stress and protects chips and gold bonding wires with low volatile content and superior chemical erosion resistance.

Technical Specifications

Optimized with hydrophobic modified formula, this material achieves industry-leading moisture ingress resistant potting performance with ultra-low water absorption after full curing. The cured layer maintains stable insulation value even in high-humidity environments. Besides outstanding waterproof capability, it possesses reliable heat dissipation identical to our mainstream Thermally Conductive Potting Compound. Hardness, viscosity and operating pot life can be customized for diverse working conditions.
 
electronic silicone

Product Features & Advantages

Compared with ordinary silicone potting glue with high water absorption, our product has unique competitive edges for humid scenarios:
1. Premium Hydrophobic Performance: Forms a dense hydrophobic barrier encapsulation structure to effectively repel water vapor and liquid water.
2. Long-term Insulation Stability: Realizes persistent long term insulation protection, preventing short circuits and leakage current caused by moisture penetration.
3. Comprehensive Environmental Resistance: Resists ozone, corrosion and temperature fluctuation while delivering dustproof and shockproof protection.
4. Superior Substrate Bonding: Firmly adheres to multiple materials to avoid moisture intrusion from gaps between glue and substrates.

Application Scenarios

As a multi-functional Electronic Encapsulation Adhesive, this low water absorption silicone is perfect for outdoor electronics, underwater sensors, bathroom appliances and coastal industrial modules. Its moisture ingress resistant potting greatly reduces damp-induced defective products, lowers replacement frequency and after-sales costs, helping manufacturers improve product service life in high-humidity areas.

Step-by-Step Usage Process

1. Pre-stirring: Evenly stir component A to disperse settled fillers; fully shake component B to guarantee uniform composition.
2. Scientific Proportioning: Mix two components strictly following standard AB weight ratio to retain complete hydrophobic performance.
3. Vacuum Defoaming: Place blended materials in a 0.01MPa vacuum container for 3 minutes to eliminate bubbles before pouring.
4. Curing Method: Cure at room temperature or heated environment; full curing takes 24 hours, same as all-purpose Silicone Encapsulant from HONG YE SILICONE.

Certifications and Compliance

All products comply with ISO9001, CE and RoHS global industrial standards. This hydrophobic potting compound meets cross-border export regulations and high-standard waterproof electronic encapsulation requirements worldwide.

Customization Options

We support one-stop personalized customization. Clients can adjust water absorption rate, cured hardness, viscosity and working time to match exclusive high-humidity encapsulation projects.

Production Process

We adopt dust-free standardized production and three-stage quality inspection. Every batch undergoes waterproof testing and humidity aging verification to ensure stable hydrophobic barrier encapsulation performance for global industrial buyers.

FAQ

Q1: What environment is this low water absorption potting compound suitable for?
A: It is specially designed for high humidity, rainy and underwater scenarios, providing professional moisture
ingress resistant potting and long term insulation protection.
Q2: Will colloidal stratification affect waterproof performance?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and its hydrophobic barrier encapsulation
ability will not be affected.
Q3: How to store mixed potting silicone?
A: Sealed raw materials have long shelf life; please use up mixed AB compound at one time to prevent performance
attenuation.
 
 
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