Product Overview
We provide addition curing and condensation curing versions of this robust Electronic Potting Compound, suitable for encapsulation, sealing and pressure-resistant filling across diverse electronic devices. It maintains excellent sealing performance and great adhesion toward PCB, PC, PMMA, CPU and multiple substrates including aluminum, copper and stainless steel. Working temperature ranges from -60℃ to 220℃, this material absorbs thermal cycling stress and protects chips and gold bonding wires from internal structural damage. Technical Specifications
Reinforced with high-hardness fillers, this material specializes in impact resistant module potting with superior surface hardness and mechanical strength. The cured silicone features low volatile content, excellent chemical stability and ozone resistance. Apart from rigid protection, it possesses reliable heat dissipation performance similar to our classic Thermally Conductive Potting Compound. Hardness grade, viscosity and curing time are fully adjustable for customized projects.
Product Features & Advantages
Compared with conventional soft silicone potting products, our high-durometer silicone has unparalleled structural advantages:
1. Rigid Protective Shell: Creates a sturdy rigid protective encapsulation shell to prevent component deformation caused by external pressure and extrusion.
2. Powerful Anti-impact Capacity: Realizes professional impact resistant module potting to buffer violent vibration and mechanical collision.
3. Multi-dimensional Protection: Equipped with corrosion resistance, dustproof, waterproof and insulation properties to adapt to harsh industrial scenarios.
4. Stable Structural Support: Offers lasting structural support protection and tight bonding for various metal and plastic electronic substrates.
Application Scenarios
As a high-strength Electronic Encapsulation Adhesive, this high-durometer silicone fits industrial control equipment, outdoor electronic modules, heavy-duty automotive electronics and vibration-prone devices. It drastically reduces electronic scrap rate caused by mechanical damage, lowers daily maintenance costs and enhances overall structural durability of finished products for manufacturers. Step-by-Step Usage Process
1. Pre-stirring: Thoroughly stir Part A to redistribute settled fillers and shake Part B evenly before mixing operation.
2. Proportional Mixing: Abide by the specified AB weight ratio to maintain intact hardness and structural performance after curing.
3. Vacuum Defoaming: Place mixed raw materials under 0.01MPa vacuum environment for 3 minutes to eliminate bubbles before potting.
4. Curing Process: Support room-temperature and heating curing; full curing takes 24 hours, same as other standard Silicone Encapsulant launched by HONG YE SILICONE. Certifications and Compliance
All products comply with ISO9001 quality management system, CE and RoHS international certifications. This high-hardness potting silicone fully meets global export standards and industrial electronic encapsulation specifications.
Customization Options
We support personalized customization. Clients can adjust durometer value, material viscosity, adhesive strength and operating time to obtain exclusive rigid encapsulation solutions.
Production Process
We adopt dust-free standardized production and multi-stage testing. Every batch will undergo hardness detection, impact resistance and temperature cycling tests to ensure stable structural protective performance for global buyers.
FAQ
Q1: What makes high durometer potting silicone different from soft silicone?
A: It forms a rigid protective encapsulation shell, providing stronger structural support protection and impact
resistant module potting against extrusion and collision.
Q2: Will glue stratification affect final hardness?
A: Colloid stratification is normal during long-term storage. Stir evenly before use, and the hardness and
protective performance will not be affected.
Q3: How to store unused mixed compound?
A: Sealed raw materials can be stored long-term; mixed two-part silicone should be used up at one time
to avoid performance degradation.