HONG YE SILICONE Low CTE Electronic Potting Silicone is a thermally stabilized silicone material designed for precision electronic packaging. This specialized Low CTE Electronic Potting Silicone adopts coefficient matched encapsulation technology to reduce thermal expansion gaps. It delivers stress minimized protection for delicate chips and gold bonding wires, combining waterproof, insulation and thermal dissipation properties to solve cracking and delamination issues caused by frequent temperature cycling.
Product Overview
Available in addition curing and condensation curing formulas, our premium Electronic Potting Compound is engineered for encapsulation, sealing and gap filling across multiple electronic industries. It features excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. With a precisely adjusted thermal expansion coefficient, this silicone material offsets thermal stress and maintains stable physical performance within -60℃ to 220℃. Technical Specifications
Formulated with low-expansion inorganic fillers, this thermal expansion controlled potting material features an ultra-low coefficient of thermal expansion that matches mainstream circuit board materials. The cured silicone has low volatile content, outstanding ozone resistance and chemical erosion resistance. Hardness, viscosity and operating pot life can be customized to satisfy diverse precision encapsulation requirements for industrial-grade electronics.
Product Features & Advantages
Different from conventional silicone potting glue with high thermal expansion coefficient, our product owns unique technical advantages:
1. Coefficient Matched Encapsulation: Realizes professionalcoefficient matched encapsulation, effectively reducing expansion and contraction differences between glue and substrates.
2. Stress Minimized Protection: Greatly relieves internal thermal stress to prevent chip cracking and wire breaking during high-low temperature alternation.
3. Comprehensive Protection: Integrates waterproof, dustproof, anti-corrosion, shockproof and insulating functions for long-term stable encapsulation.
4. High Compatibility: Bonds tightly with various metals and plastic materials without degumming or peeling in harsh working environments.
Application Scenarios
As a high-performanceElectronic Encapsulation Adhesive, this low CTE silicone is widely applied for semiconductor components, automotive core electronics, medical sensing modules and high-end LED devices. It effectively reduces product failure rate caused by thermal stress, cuts after-sales maintenance costs and improves finished product yield for electronic manufacturers. Step-by-Step Usage Process
1. Pre-stirring: Evenly stir A component to mix settled fillers thoroughly and shake B component fully before batching.
2. Proportional Mixing: Follow standard AB weight ratio to ensure stable low-CTE performance after complete curing.
3. Vacuum Defoaming: Place blended glue in a 0.01MPa vacuum container for 3 minutes to eliminate bubbles before pouring.
Certifications and Compliance
All products launched by HONG YE SILICONE comply with ISO9001, CE and RoHS standards. This professional Silicone Encapsulant meets global cross-border export regulations and high-standard precision electronic packaging specifications. Customization Options
We provide one-stop customized services. Clients can adjust thermal expansion coefficient, cured hardness, overall viscosity and working time to fit exclusive encapsulation projects.
Production Process
We adopt dust-free standardized production and multi-stage quality inspection. Every batch of low CTE potting silicone will pass thermal cycling and stress testing to guarantee consistent batch quality for global industrial buyers.
FAQ
Q1: What are the main benefits of low CTE potting silicone?
A: It realizes thermal expansion controlled potting, minimizing internal stress to avoid encapsulation cracking under repeated
temperature changes.
Q2: Will colloidal stratification affect thermal expansion performance?
A: Stratification belongs to normal storage phenomenon. Stir evenly before use, and it will not weaken coefficient matched
encapsulation and stress minimized protection effects.
Q3: How to store mixed low CTE silicone?
A: Seal raw materials and store in dry environments. Mixed two-part compound needs to be used up at one time to prevent
performance attenuation.
Shenzhen Hong Ye Jie Technology Co., Ltd
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