HONG YE SILICONE’s Pressure Equalizing Electronic Potting Silicone is a professional ambient pressure adaptiveElectronic Potting Compound. Serving as high-performance Electronic Encapsulation Adhesive, durable Silicone Encapsulant and upgraded version of traditional Thermally Conductive Potting Compound, it features vented design encapsulation and differential balance module potting. This functional silicone provides reliable altitude change protection, eliminating internal and external pressure differences to prevent component damage, while delivering waterproof, insulation and wide-temperature stable protection for electronics.
Product Overview
This pressure equalizing potting silicone includes addition curing and condensation curing formulas, specially developed for electronic devices working in altitude-variable and pressure-fluctuating environments. It is widely used for encapsulation, sealing, filling and pressure resistance of various electronic components, with excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. With unique pressure balance structure, it realizes effective vented design encapsulation and differential balance module potting. It works stably at -60℃ to 220℃, releases internal stress caused by temperature and altitude changes to protect chips and gold bonding wires, with low volatility and high structural toughness.
Technical Specifications
This pressure adaptive silicone potting material features excellent pressure equalizing performance, automatically balancing internal and external air pressure to avoid bulging, cracking and shell deformation. It boasts superior ozone resistance and chemical erosion resistance, maintaining stable protection under frequent altitude and pressure changes. It has high bonding strength and low volatile content, with customizable viscosity, hardness and operating time to fit diverse industrial electronic packaging needs.
Product Features & Advantages
Different from ordinary fully sealed rigid potting silicone prone to pressure damage, this product has exclusive adaptive advantages:
1. Automatic pressure balance: Realizes professional differential balance module potting, relieving pressure difference caused by altitude and temperature changes.
2. Unique vented design encapsulation: Prevents encapsulation layer cracking and component extrusion failure, achieving stable altitude change protection.
3. Multi-functional protection: Integrates pressure resistance, waterproof, dustproof, anti-corrosion and insulation performance with ultra-wide temperature adaptability.
4. Stress buffering performance: Absorbs thermal cycling stress and air pressure impact, greatly extending electronic component service life.
Application Scenarios
Ideal for aerospace electronics, high-altitude detection equipment, outdoor automotive modules and portable altitude-sensitive electronic devices. Its pressure equalizing performance avoids equipment failure caused by air pressure changes, reduces product damage rate in cross-region and high-altitude operation, cuts maintenance costs and improves product environmental adaptability.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A evenly to disperse settled fillers completely and thoroughly shake component B before mixing.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable pressure equalizing performance after curing.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming to ensure uniform cured structure.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.
Certifications & Compliance
This product complies with ISO9001, CE and ROHS international standards, meeting high-altitude electronic protection and global cross-border export specifications.
Customization Options
Customized services are available. Pressure balance sensitivity, hardness, viscosity and operating time can be adjusted for exclusive pressure-adaptive electronic packaging solutions.
Production & Quality Control
We adopt standardized dust-free production and strict pressure resistance testing. Pre-production formula verification and pre-shipment full inspection ensure stable altitude change protection and consistent batch quality.
FAQ
Q1: What is the core advantage of pressure equalizing potting silicone?
A: It realizes differential balance module potting and vented design encapsulation, solving electronic damage
caused by altitude and air pressure changes that ordinary potting glue cannot handle.
Q2: Will colloid stratification affect pressure balance performance?
A: No. Slight storage stratification is normal, and even stirring will not damage its pressure equalizing and altitude
protection capabilities.
A: Seal raw materials and store in dry environments. Mixed AB silicone should be used up at one time to avoid
performance attenuation.
Shenzhen Hong Ye Jie Technology Co., Ltd
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