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Home> Products> Electronic Potting Compound> High Adhesion Electronic Potting Compound
High Adhesion Electronic Potting Compound
High Adhesion Electronic Potting Compound
High Adhesion Electronic Potting Compound
High Adhesion Electronic Potting Compound
High Adhesion Electronic Potting Compound
High Adhesion Electronic Potting Compound

High Adhesion Electronic Potting Compound

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9010

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-5
Product Description
HONG YE SILICONE’s premium potting silicone is engineered for high-demanding electronic sealing and encapsulation projects. Formulated for zero-primer bonding, this upgraded silicone material strengthens structural tightness for electronic assemblies and shields circuits from moisture, vibration and extreme ambient temperatures. (Target Keyword: High Adhesion Electronic Potting Compound)
 
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Product Overview

We provide two mainstream formulas, including addition curing and condensation curing types to satisfy diverse manufacturing needs. This specialized electronic Potting Compound is widely used for encapsulation, filling and pressure protection. It delivers perfect compatibility with PCB, PMMA, CPU and multiple metal substrates such as copper and stainless steel, maintaining stable performance from -60℃ to 220℃.

Technical Specifications

Modified with high-density adhesive additives, this strong bonding encapsulation material eliminates delamination risks under thermal cycling. The cured material features low volatile content, excellent ozone resistance and outstanding thermal dissipation capability. Physical indicators including hardness and viscosity can be customized to fit unique production parameters for industrial electronics.

Product Features & Advantages

Different from ordinary sealants with weak surface adhesion, our product has core differentiated advantages:
1. Primer-Free Operation: Realizes professional primerless adhesion module potting, simplifies pre-treatment procedures and accelerates production efficiency.
2. Superior Substrate Compatibility: Achieves enhanced substrate grip protection for plastics and metals, avoiding peeling failure in harsh environments.
3. Multi-dimensional Protection: Integrates insulation, waterproofing and anti-corrosion functions to protect chips and gold bonding wires effectively.
4. Wide temperature adaptability: Absorbs internal stress to extend the service life of precision electronic parts.
 
electronic silicone
 
Application Scenarios
As a high-performance Electronic Encapsulation Adhesive, this potting silicone is ideal for LED lighting modules, automotive electronics, sensors and industrial control equipment. It effectively solves common packaging pain points like glue peeling and poor sealing, helping manufacturers reduce defective rate and long-term maintenance costs.

Step-by-Step Usage Process

1. Pre-stirring: Evenly stir component A to disperse settled fillers, and fully shake component B before mixing.
2. Proportional Mixing: Follow the official AB weight ratio to ensure stable bonding performance after curing.
3. Vacuum Defoaming: Place blended materials under 0.01MPa vacuum environment for 3 minutes to remove internal bubbles.
4. Curing Method: Cure at room temperature or heated environment; full curing time is 24 hours. This rule also applies to our conventional Thermally Conductive Potting Compound series.

Certifications and Compliance

All products from HONG YE SILICONE are certified with ISO9001, CE and RoHS. Every batch of our high-performanceSilicone Encapsulant complies with international export standards and industrial electronic packaging regulations.

Customization Options

We support one-stop personalized customization. Clients can adjust adhesive strength, hardness, viscosity and working time to match their exclusive electronic packaging scenarios.

Production Process

We adopt dust-free standardized production and three-stage quality inspection. All raw materials and finished goods are tested for bonding strength and temperature resistance to guarantee stable batch quality for global clients.

FAQ

Q1: Do I need to apply primer before encapsulation?
A: Additional primer is not required. This product supports primerless adhesion module potting to cut your production budget.
Q2: Why does stratification occur inside raw glue?
A: Colloid stratification is a normal storage phenomenon. Stir evenly before use, and it will not affect enhanced substrate grip protection effect.
Q3: How to store unused mixed glue?
A: Mixed two-part materials cannot be stored long-term. Please use up the compound at one time for better using effect.
 
 
 
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