Product Overview
This low surface energy potting silicone includes addition curing and condensation curing formulas, designed for anti-wetting encapsulation and stain-resistant module potting. It is widely used for sealing, filling and pressure protection of various electronic components, featuring outstanding adhesion and thermal stability for PCB, PC, PMMA, CPU and multiple metal substrates like aluminum and stainless steel. With unique low surface energy formula, it realizes stain resistant module potting and easy clean protection. It operates stably at -60℃ to 220℃, absorbing thermal cycling stress to protect chips and gold bonding wires, with low volatile content and high structural strength.
Technical Specifications
This specialized potting compound adopts low surface energy modification technology, featuring excellent anti wetting encapsulation performance to repel dust, water stains and chemical contaminants. It owns superior ozone resistance and anti-chemical erosion capacity, maintaining stable physical and insulating properties under long-term complex environments. All core indicators including viscosity, hardness and operating time support personalized customization to fit diverse electronic packaging demands.
Product Features & Advantages
Different from ordinary electronic potting silicone, this product has exclusive anti-fouling and self-cleaning strengths:
1. Low surface energy performance: Realizes effective anti wetting encapsulation, preventing dust, oil and water stain adhesion for long-term clean module surface.
2. Stain resistant & easy clean: Supports easy clean protection, greatly reducing equipment cleaning frequency and maintenance difficulty.
3. Full protective performance: Integrates waterproof, moisture-proof, anti-corrosion, shockproof and insulation functions with wide temperature adaptability.
4. Stable bonding & low volatility: Firmly adheres to various substrates with zero pollution to precision electronic circuits.
Application Scenarios
Ideal for outdoor electronic modules, industrial control equipment, smart sensor devices and precision circuit units that require long-term clean operation. Its stain resistant module potting performance effectively avoids fouling-induced circuit failure, reduces daily maintenance costs, extends electronic service life and improves product stability for manufacturers.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A evenly to mix settled fillers completely and shake component B thoroughly before use.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable low surface energy performance after curing.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming before pouring.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.
Certifications & Compliance
This product complies with ISO9001, CE and ROHS international standards, meeting global precision electronic encapsulation and cross-border export specifications.
Customization Options
Customized services are available. Surface energy grade, hardness, viscosity and operating time can be adjusted to meet exclusive anti-fouling electronic packaging needs.
Production & Quality Control
We implement standardized production and strict surface performance testing. Pre-production formula verification and pre-shipment full inspection ensure stable anti-wetting and stain-resistant performance of each batch.
FAQ
Q1: What is the core value of low surface energy potting compound?
A: It provides lasting anti-wetting and stain-resistant effects, keeping encapsulated modules clean, reducing failure risks
and lowering maintenance costs.
Q2: Will colloid stratification affect anti-fouling performance?
A: No. Slight storage stratification is normal, and even stirring will not damage its low surface energy and easy-clean properties.
Q3: How to store mixed potting silicone?
A: Seal raw materials and store in dry environments. Mixed glue should be used up at one time to avoid performance attenuation.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
