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Home> Products> Electronic Potting Compound> Particle Barrier Electronic Potting Compound
Particle Barrier Electronic Potting Compound
Particle Barrier Electronic Potting Compound
Particle Barrier Electronic Potting Compound
Particle Barrier Electronic Potting Compound
Particle Barrier Electronic Potting Compound
Particle Barrier Electronic Potting Compound

Particle Barrier Electronic Potting Compound

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-9325

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound
Product Description
HONG YE SILICONE’s Particle Barrier Electronic Potting Compound is a high-efficiency dustproof electronic Potting Compound built for precision electronic protection. Serving as premium Electronic Encapsulation Adhesive, durableSilicone Encapsulant and upgraded alternative to conventional Thermally Conductive Potting Compound, it delivers professional dust proof encapsulation and contamination blocking module potting. This cleanroom compatible particle barrier electronic potting compound isolates fine particles and pollutants, while offering insulation, waterproofing and extreme temperature resistance for delicate electronic components.
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Product Overview

This particle barrier potting silicone includes addition curing and condensation curing formulas, specialized in particle isolation and contamination prevention encapsulation. It is widely used for sealing, filling and pressure protection of various electronic devices, featuring excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. With a dense cured structure, it achieves reliable cleanroom compatible protection, effectively blocking dust, debris and fine particles. It stably operates at -60℃ to 220℃, absorbs thermal cycling stress to protect chips and gold bonding wires, with low volatile content and high structural strength.

Technical Specifications

This barrier-type silicone potting material features ultra-dense curing structure for superior dust proof encapsulation and contamination blocking module potting performance. It boasts excellent ozone resistance and chemical erosion resistance, maintaining intact barrier performance under long-term high-low temperature cycling and humid environments. It has low volatility and high bonding strength for diverse metal and non-metal substrates. Viscosity, hardness and operating time support full personalized customization for precision electronic packaging.
 
electronic silicone

Product Features & Advantages

Different from ordinary potting silicone with loose structure and weak dust resistance, this product has exclusive particle barrier strengths:
1. Powerful particle barrier: Dense cured layer fully blocks fine dust, debris and airborne contaminants, realizing long-term clean module protection.
2. Cleanroom compatible performance: Low volatile formula adapts to precision manufacturing environments, no secondary pollution to electronic components.
3. Multi-dimensional protection: Integrates dustproof, waterproof, anti-corrosion, shockproof and insulation functions with wide temperature adaptability.
4. Stable structural toughness: Absorbs thermal stress effectively, preventing cracking and particle penetration caused by temperature changes.

Application Scenarios

Ideal for cleanroom electronic equipment, precision sensors, semiconductor modules and high-end communication electronics. Its contamination blocking module potting performance avoids particle-induced short circuit and component failure, reduces product defective rates and cleaning maintenance costs, and improves long-term operational stability of precision electronic products.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A evenly to disperse settled fillers completely and thoroughly shake component B before mixing.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable particle barrier performance after curing.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming to avoid barrier structure defects.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.

Certifications & Compliance

This product complies with ISO9001, CE and ROHS international standards, meeting cleanroom electronic packaging and global cross-border export specifications.

Customization Options

Customized services are available. Barrier density, hardness, viscosity and operating time can be adjusted to match exclusive precision electronic protection demands.

Production & Quality Control

We adopt dust-free standardized production and strict barrier performance testing. Pre-production formula verification and pre-shipment full inspection ensure stable particle blocking capacity and consistent batch quality.

FAQ

Q1: What makes this particle barrier potting compound different from ordinary potting silicone?
A: It features a dense barrier structure and cleanroom compatibility, effectively blocking fine particles and contaminants that cause precision electronic failure.
Q2: Will colloid stratification affect dust barrier performance?
A: No. Slight storage stratification is normal, and even stirring will not damage its dense structure and particle blocking ability.
Q3: How to store mixed barrier potting silicone?
A: Seal raw materials and store in dry clean environments. Mixed glue should be used up at one time to avoid performance attenuation.
 
 
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