Product Overview
This high lubricity potting silicone includes addition curing and condensation curing formulas, specialized in smooth surface module potting for movable electronic components. It is widely applied for encapsulation, sealing, filling and pressure resistance of various electronics, with excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. Featuring unique lubricating modification formula, it achieves lasting low friction and anti-wear effects. It stably operates at -60℃ to 220℃, absorbs thermal cycling stress to protect chips and gold bonding wires, with ultra-low volatile content and high structural strength.
Technical Specifications
This high-lubricity silicone potting material adopts advanced lubrication modification technology, realizing stable low friction encapsulation and outstanding abrasion reduction protection. It boasts excellent ozone resistance and chemical erosion resistance, maintaining smooth surface texture and stable physical performance under long-term friction and temperature alternation. Viscosity, hardness, lubricity grade and operating time support full personalized customization to meet diverse movable electronic packaging requirements.
Product Features & Advantages
Different from ordinary rigid and high-friction potting silicone, this product has exclusive anti-wear and smooth performance advantages:
1. High lubricity & low friction: Creates ultra-smooth cured surface, effectively reducing friction coefficient and mechanical wear of movable electronic parts.
2. Superior abrasion resistance: Provides long-term abrasion reduction protection, extending the service life of friction-prone electronic modules.
3. All-round protective performance: Integrates waterproof, dustproof, anti-corrosion, shockproof and insulation functions with wide temperature adaptability.
4. Stable bonding & low volatility: Firmly adheres to multiple substrates with no volatile residue, ensuring safe and stable electronic operation.
Application Scenarios
Ideal for movable electronic components, flexible module devices, mechanical sensing electronics and telescopic circuit units. Its smooth surface module potting performance minimizes friction loss and mechanical failure, reduces equipment wear and maintenance costs, improves product operating stability and durability, and enhances core market competitiveness for electronic manufacturers.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A evenly to disperse settled fillers completely and thoroughly shake component B before mixing.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable lubricity and curing performance.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming before pouring and encapsulation.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, and curing effect is affected by ambient temperature and humidity.
Certifications & Compliance
This product complies with ISO9001, CE and ROHS international standards, meeting global high-precision electronic encapsulation and cross-border export specifications.
Customization Options
Professional customized services are available. Lubricity grade, hardness, viscosity and operating time can be adjusted to support exclusive low-friction electronic packaging solutions.
Production & Quality Control
We adopt standardized dust-free production and strict lubricity & abrasion resistance testing. Pre-production formula verification and pre-shipment full inspection ensure stable low-friction performance and consistent batch quality.
FAQ
Q1: What is the core advantage of high lubricity electronic potting silicone?
A: It provides low friction encapsulation and abrasion reduction protection, solving wear failure of movable electronic modules that ordinary potting glue cannot handle.
Q2: Will colloid stratification affect lubricity performance?
A: No. Slight stratification during storage is normal, and uniform stirring will not weaken its smooth surface and anti-wear properties.
A: Seal raw materials and store in dry environments. Mixed AB glue should be used up at one time to avoid performance attenuation.
Shenzhen Hong Ye Jie Technology Co., Ltd
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