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Home> Products> Electronic Potting Compound> Thixotropic Electronic Potting Silicone
Thixotropic Electronic Potting Silicone
Thixotropic Electronic Potting Silicone
Thixotropic Electronic Potting Silicone
Thixotropic Electronic Potting Silicone
Thixotropic Electronic Potting Silicone
Thixotropic Electronic Potting Silicone

Thixotropic Electronic Potting Silicone

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
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Product Attributes

Model No.: HY-9310

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Product Description
HONG YE SILICONE’s Thixotropic Electronic Potting Silicone is a high-performance anti-sag Silicone Potting Compound designed for vertical and irregular electronic packaging. Made of refined thickened liquid silicone and stable RTV 2 Silicone Rubber, it adopts mature formulas of industrial Mold Making Silicone and Pad printing silicone rubber. As premium industrial Silicone raw materials and practical Electronic Encapsulation Adhesive, it features excellent thixotropy, no sagging or flowing during construction, paired with full insulation, waterproof and wide-temperature protective performance for electronic components.
 
HY-SILICONE company

Product Overview

This thixotropic potting silicone includes addition curing and condensation curing types, specialized in vertical surface encapsulation, local sealing and irregular gap filling of electronic devices. It delivers superior adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. With unique thixotropic formula, it maintains stable viscosity after coating, effectively solving glue sagging and offset problems. It stably operates at -60℃ to 220℃, absorbs thermal cycling stress to protect chips and gold bonding wires, with outstanding dustproof, anti-corrosion and ozone-resistant performance.

Technical Specifications

This thixotropic Silicone Encapsulant features excellent shear thinning and anti-sag performance, adapting to vertical and overhead construction. It has ultra-low volatile content and high structural strength, retaining stable thixotropy and sealing effect under temperature and humidity changes. It resists chemical erosion and high-low temperature aging effectively. Viscosity, thixotropy index, hardness and operating time support full personalized customization for special packaging scenarios.
 
electronic silicone

Product Features & Advantages

Different from ordinary fluid potting silicone prone to sagging, this thixotropic product has exclusive construction advantages:
1. Excellent thixotropic anti-sag: No flowing or sagging on vertical and irregular surfaces, realizing precise fixed-point potting and sealing.
2. Comprehensive protection: Integrates waterproof, moisture-proof, dustproof and shockproof functions with superior ozone and chemical resistance.
3. Wide temperature stability: Works steadily in -60℃ to 220℃, buffering internal thermal stress to protect precision electronic parts.
4. High bonding compatibility: Firmly adheres to multiple metals and non-metals with low volatility, clean and residue-free packaging.

Application Scenarios

Ideal for vertical circuit boards, overhead electronic modules, irregular gap equipment and local fixed-point potting projects. Its anti-sag performance improves construction accuracy and yield, reduces glue waste and rework rate, saves production costs, and helps manufacturers achieve efficient and high-precision electronic packaging.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A evenly to disperse settled fillers completely and thoroughly shake component B.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable thixotropy and curing performance.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming before pouring and coating.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.

Certifications & Compliance

This product complies with ISO9001, CE and ROHS international standards, meeting global special-scene electronic packaging and cross-border export specifications.

Customization Options

Customized services are available. Thixotropy strength, hardness, viscosity and operating time can be adjusted for personalized anti-sag packaging solutions.

Production & Quality Control

We adopt standardized production and strict thixotropy performance testing. Pre-production formula verification and pre-shipment full inspection ensure stable anti-sag performance and consistent batch quality.

FAQ

Q1: What is the core advantage of thixotropic potting silicone? A: It features anti-sag and non-flowing properties, suitable for vertical and irregular surfaces to realize precise potting that ordinary fluid glue cannot achieve.
Q2: Will colloid stratification affect thixotropic performance? A: No. Slight storage stratification is normal, and even stirring will not weaken its anti-sag and protective performance.
Q3: How to store mixed thixotropic Potting Compound? A: Seal and store raw materials in dry environments. Mixed AB silicone should be used up at one time to avoid thixotropy attenuation.
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