Product Overview
This low vapor permeability potting silicone includes addition curing and condensation curing types, dedicated to high-barrier encapsulation, sealing and filling of precision electronic components. It boasts exceptional adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. Its dense cured structure effectively blocks water vapor and gas penetration, solving internal condensation and damp failure issues. It stably operates at -60℃ to 220℃, absorbs thermal cycling stress to protect chips and gold bonding wires, with excellent anti-corrosion, dustproof and ozone-resistant properties.
Technical Specifications
This low vapor permeability Silicone Encapsulant features ultra-low water vapor transmission rate with dense and pore-free cured structure. It has minimal volatile content and stable barrier performance, resisting long-term damp and harsh atmospheric erosion. It maintains intact sealing and insulation under alternating temperature and humidity environments. Viscosity, hardness and operating time support full customized adjustment to meet high-barrier packaging standards.
Product Features & Advantages
Different from ordinary potting silicone with high vapor permeability, this product owns unique barrier protection strengths:
1. Ultra-low vapor permeability: Dense molecular structure effectively blocks water vapor and gas penetration, preventing internal electronic dampness and condensation.
2. Multi-functional protection: Integrates waterproof, dustproof, anti-corrosion and shockproof performance with superior ozone and chemical resistance.
3. Wide temperature adaptability: Stably maintains barrier performance in -60℃ to 220℃, buffering thermal stress to protect core components.
4. Reliable bonding: Firmly adheres to diverse substrates with low volatility, no pollution to precision circuits.
Application Scenarios
Ideal for outdoor electronics, sealed sensing modules, communication equipment and precision instruments requiring long-term damp resistance. Its ultra-low vapor permeability avoids internal circuit damp failure and oxidation damage, extending equipment service life, reducing maintenance and replacement costs, and improving product stability in high-humidity environments.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A to evenly disperse settled fillers and thoroughly shake component B before mixing.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable low vapor permeability after curing.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming before pouring.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.
Certifications & Compliance
This product complies with ISO9001, CE and ROHS international standards, meeting global high-barrier electronic packaging and cross-border export specifications.
Customization Options
Customized services are available. Vapor permeability grade, hardness, viscosity and operating time can be adjusted for personalized high-barrier packaging solutions.
Production & Quality Control
We implement standardized dust-free production and strict vapor permeability testing. Pre-production verification and pre-shipment full inspection ensure stable barrier performance and consistent batch quality.
FAQ
Q1: What is the core advantage of low vapor permeability potting silicone? A: It delivers ultra-low vapor barrier performance, effectively blocking water vapor penetration and preventing electronic damp failure in high-humidity environments.
Q2: Will colloidal stratification affect barrier performance? A: No. Slight storage stratification is normal, and even stirring will not change its low vapor permeability and protective properties.
Q3: How to store mixed low vapor permeability Potting Compound? A: Keep raw materials sealed and dry. Mixed AB silicone should be used up at one time to avoid performance attenuation. 
Shenzhen Hong Ye Jie Technology Co., Ltd
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