Product Overview
This hydrophobic potting silicone includes addition curing and condensation curing formulas, dedicated to waterproof encapsulation, sealing, filling and pressure protection of various electronic devices. It offers exceptional adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. With superior hydrophobic properties, the cured layer repels water and resists moisture infiltration fundamentally. It stably operates at -60℃ to 220℃, absorbs thermal cycling stress to protect chips and gold bonding wires, with outstanding dustproof, ozone-resistant and chemical erosion resistance.
Technical Specifications
This super hydrophobic Silicone Encapsulant boasts excellent water-repellent and anti-moisture performance with low water absorption rate. It features ultra-low volatile content and high structural strength, maintaining stable hydrophobic and insulating properties under long-term humid and temperature alternating conditions. It resists aging and chemical corrosion effectively. Viscosity, hardness and operating time support full personalized customization to meet diverse electronic waterproof packaging demands. Product Features & Advantages
Different from ordinary moisture-proof potting silicone, this hydrophobic product provides upgraded waterproof protection:
1. Super hydrophobic performance: Surface water-repellent property blocks water adhesion and penetration, achieving long-term waterproof and anti-condensation effects.
2. Comprehensive protection: Integrates waterproof, dustproof, anti-corrosion and shockproof functions with excellent ozone and chemical resistance.
3. Extreme temperature tolerance: Stably works in -60℃ to 220℃, buffering internal thermal stress to protect precision electronic structures.
4. High-strength adhesion: Firmly bonds multiple metal and non-metal substrates with low volatility, no damage to precision circuits.
Application Scenarios
Ideal for outdoor electronics, underwater detection modules, bathroom electrical equipment and industrial humid-environment electronic components. Its super hydrophobic performance thoroughly solves electronic failure caused by dampness and water ingress, reducing product defective rates and after-sales maintenance costs, and greatly improving product durability and environmental adaptability.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A evenly to disperse settled fillers completely and shake component B thoroughly.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable hydrophobic performance after curing.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming before pouring.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.
Certifications & Compliance
This product complies with ISO9001, CE and ROHS international standards, meeting global waterproof electronic packaging and cross-border export specifications.
Customization Options
Customized services are available. Hydrophobic grade, hardness, viscosity and operating time can be adjusted for personalized waterproof packaging solutions.
Production & Quality Control
We adopt standardized production and strict hydrophobic performance testing. Pre-production verification and pre-shipment full inspection ensure stable water-repellent performance and consistent batch quality.
FAQ
Q1: What is the difference between hydrophobic and ordinary waterproof potting silicone? A: It owns super water-repellent surface performance, actively repels water, provides more durable and reliable waterproof protection
than conventional moisture-proof adhesives.
Q2: Will colloidal stratification affect hydrophobic performance? A: No. Slight storage stratification is normal, and even stirring will not weaken its water-repellent and protective properties.
Q3: How to store mixed hydrophobic Potting Compound ? A: Seal and store raw materials in dry environments. Mixed AB silicone should be used up at one time to avoid performance degradation.