Product Overview
This ESD-safe potting silicone includes addition curing and condensation curing types, designed for anti-static encapsulation, sealing, filling and pressure protection of vulnerable electronic components. It delivers excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. With stable electrostatic dissipation performance, it releases static charges safely to avoid sudden electrostatic breakdown. It operates steadily from -60℃ to 220℃, absorbs thermal cycling stress to protect chips and gold bonding wires, with outstanding dustproof, anti-corrosion and ozone-resistant properties.
Technical Specifications
This anti-static Silicone Encapsulant features stable surface resistance and continuous electrostatic discharge capacity without static accumulation. It has ultra-low volatile content and high structural strength, retaining consistent ESD protection and insulation under long-term temperature and humidity changes. It resists chemical erosion and ozone aging effectively. Hardness, viscosity and operating time support full personalized customization for precision electronic anti-static packaging.
Product Features & Advantages
Different from ordinary insulating potting silicone prone to static buildup, this ESD-safe product provides exclusive static protection:
1. Professional ESD safety: Steadily dissipates static charges, avoiding electrostatic breakdown and burnout of precision electronic components.
2. All-round protective performance: Integrates anti-static, waterproof, dustproof and shockproof functions with superior chemical and ozone resistance.
3. Wide temperature adaptability: Maintains stable ESD performance in -60℃ to 220℃, buffering internal thermal stress effectively.
4. Premium bonding stability: Firmly adheres to diverse substrates with low volatility, no pollution to precision circuits.
Application Scenarios
Perfect for precision sensors, semiconductor modules, wearable electronics and industrial static-sensitive electronic equipment. Its reliable ESD protection eliminates static damage risks in production and operation, reduces product defective rates and failure losses, and improves electronic product stability and service life for manufacturers.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A evenly to disperse settled fillers completely and thoroughly shake component B.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable anti-static performance after curing.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming before pouring.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.
Certifications & Compliance
This product complies with ISO9001, CE and ROHS international standards, meeting global anti-static electronic packaging and cross-border export specifications.
Customization Options
Customized services are available. ESD resistance grade, hardness, viscosity and operating time can be adjusted for personalized anti-static packaging solutions.
Production & Quality Control
We implement standardized production and strict ESD performance testing. Pre-production verification and pre-shipment full inspection ensure stable electrostatic dissipation performance and consistent batch quality.
FAQ
Q1: Why choose ESD safe potting silicone over ordinary types? A: It actively dissipates static electricity to prevent electrostatic damage to precision chips and circuits, a core safety advantage for static-sensitive electronics.
Q2: Will colloidal stratification affect anti-static performance? A: No. Slight storage stratification is normal, and even stirring will not weaken its ESD safety and protective properties.
Q3: How to store mixed ESD safe Potting Compound? A: Seal and store raw materials in dry static-free environments. Mixed AB silicone should be used up at one time to avoid performance attenuation.